In this paper, we propose a three-dimensional (3D) stacked power supply on chip (SoC), which comprises stack of a GaN power device, Si-LSI, and passive devices to reduce the parasitic impedance. We also evaluate the 3D stacked power SoC by electromagnetic and circuit simulations in a 3 ' 3 mm 2 square chip. In addition, we clarify the impact of the 3D stacked power SoC for a high-frequency DC-DC converter against the printed circuit board (PCB)-based DC-DC converter. The efficiency of the 3D stacked power SoC is always higher than that of the conventional GaNbased DC-DC converter.