A 1-V Operated MEMS Variable Optical Attenuator Using Piezoelectric PZT Thin-Film Actuators

Lee, Chengkuo; Hsiao, Fu‐Li; Kobayashi, Takeshi; Koh, Kah How; Ramana, P.V.; Xiang, Wenfeng; Tan, Chee Wei; Pinjala, D.

doi:10.1109/jstqe.2009.2022959

Cited by 35 publications

(7 citation statements)

References 50 publications

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“…The WDL at driving voltages of 0 V dc (1.8 dB), 1.5 V dc (10 dB), 2.2 V dc (20 dB) and 2.8 V dc (30 dB) are less than 0.06 dB, 0.31 dB, 0.39 dB and 0.53 dB respectively. These WDL data measured at the various attenuation states are of the same level with those data already reported in [32][33][34][35][36][37][38][39][40][41][42][43][44][45][46][47][48][49].…”

Section: Optomechanical Performance For the Electromagnetic Attenuati...supporting

confidence: 85%

“…Isamoto et al have demonstrated a 3D VOA using the electrostatic parallel plate actuator in which the derived performance was outstanding as only 4.5 V dc was needed to achieve 0.3 • rotational angle and 40 dB attenuation range [47]. Recently, we have also developed two 3D MEMS VOA devices based on piezoelectric actuation, where these works are the first reported attempt of 3D attenuated MEMS VOAs using crystalline PZT thin film actuators [48,49]. Both of our designs were based on piezoelectric actuation and required only 1 V dc to achieve 40 dB dynamic range of attenuation.…”

Section: Introductionmentioning

confidence: 96%

“…With proper design of actuators, a well-optimized DRIE process and appropriate selection of lens fibers, single-reflective-type VOAs performance are superior to shutter-type VOAs. Combining optics and a tilt mirror to be assembled in a 3D configuration is also another key approach to make MEMS VOA devices [47][48][49]. When tilt mirrors are deployed for 3D VOA in conjunction with large micro-optics such as a dual-fiber collimator, the resulting VOA device can gain excellent data in terms of return loss, polarization-dependent loss and wavelength-dependent loss under a reasonable driving voltage and small rotational angle.…”

Section: Introductionmentioning

confidence: 99%

“…From the literature review above, it can be observed that limited research effort has been reported in 3D MEMS VOAs in contrast to the widely reported activities in planar MEMS VOAs. Although 3D MEMS VOAs driven by piezoelectric PZT actuators have been demonstrated to achieve 40 dB at 1 V dc previously [48,49], PZT is not a CMOS compatible material. With the future vision of having a monolithic integrated MEMS VOA with CMOS-integrated circuits, we endeavor to develop a novel and CMOS compatible actuation mechanism to achieve optical attenuation.…”

Section: Introductionmentioning

confidence: 99%

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Design and characterization of a 3D MEMS VOA driven by hybrid electromagnetic and electrothermal actuation mechanisms

Koh

Qian

Lee

2012

J. Micromech. Microeng.

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By using a CMOS compatible process technology, a MEMS variable optical attenuator (VOA) is characterized in terms of actuation mechanisms. A dual-fiber collimator is aligned perpendicularly to the micromirror in a three-dimensional (3D) free space configuration, where the micromirror is mechanically connected with an electromagnetic actuator and two sets of electrothermal actuators. Three types of attenuation schemes based on electromagnetic, electrothermal and hybrid, i.e. combination of electrothermal and electromagnetic, actuations have been explored and studied. Dynamic attenuation ranges of 40 dB have been achieved at 4 V dc , 26 mW and 3 V dc, 20 mW by electromagnetic and electrothermal attenuation schemes respectively. Wavelength-dependent loss has been demonstrated to be less than 0.6 dB at all attenuation states for both attenuation schemes. In the hybrid attenuation scheme, various voltage combinations are made to the electromagnetic and electrothermal actuators. An optical attenuation of approximately 40 dB can be obtained when two volts are applied to both the electromagnetic and electrothermal actuators simultaneously, while the electrical power consumption of the actuators is 17 mW in total. Our unique design of using both electrothermal and electromagnetic actuators simultaneously to achieve attenuation is the first demonstration of such a hybrid-driven CMOS compatible MEMS VOA device.

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Section: Optomechanical Performance For the Electromagnetic Attenuati...supporting

confidence: 85%

Section: Introductionmentioning

confidence: 96%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Design and characterization of a 3D MEMS VOA driven by hybrid electromagnetic and electrothermal actuation mechanisms

Koh

Qian

Lee

2012

J. Micromech. Microeng.

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show abstract

“…[165,166] BAW resonators consist of a piezoelectric film placed between two metal electrodes, inducing an acoustic wave that propagates vertically along the bulk of the piezoelectric film and forms a standing wave between the electrodes. The piezoelectric film plays an important role in MEMS systems, such as optical attenuators, [167][168][169][170][171] scanning mirrors, [172][173][174][175][176] and energy harvesters [177][178][179][180][181][182][183][184][185][186] and transducers. [187][188][189][190] To increase communication frequency to the terahertz range, small-scale integrated photonic resonators have been studied and demonstrated, driving exploration at both the signal transmitter and receiver sides.…”

Section: Photonic Resonatormentioning

confidence: 99%

Recent Progress in Silicon‐Based Photonic Integrated Circuits and Emerging Applications

Xiao,

Liu,

et al. 2023

Advanced Optical Materials

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In recent years, with the further ministration of the semiconductor device in integrated circuits, power consumption and data transmission bandwidth have become insurmountable obstacles. As an integrated technology, photonic integrated circuits (PICs) have a promising potential in the post‐Moore era with more advantages in data processing, communication, and diversified sensing applications for their ultra‐high process speed and low power consumption. Silicon photonics is believed to be an encouraging solution to realize PICs because of the mature CMOS process. The past decades have witnessed a huge growth in silicon PICs. However, there is still a demand for the development of silicon PICs to enable powerful chip‐scale systems and new functionalities. In this paper, a review of the photonic components, functional blocks, and emerging applications for PICs is offered. The common photonic components are classified into several sections, including on‐chip light sources, fiber‐to‐chip couplers, photonic resonators, waveguide‐based sensors, on‐chip photodetectors, and modulators. The functional blocks of the PICs mentioned in this review are photonic memories and photonic neural networks. Finally, the paper concludes with emerging applications for further study.

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Design and fabrication of all-polymer thermo-optic variable optical attenuator with low power consumption

Sun

Wang

et al. 2017

Appl. Phys. A

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A 1-V Operated MEMS Variable Optical Attenuator Using Piezoelectric PZT Thin-Film Actuators

Cited by 35 publications

References 50 publications

Design and characterization of a 3D MEMS VOA driven by hybrid electromagnetic and electrothermal actuation mechanisms

Design and characterization of a 3D MEMS VOA driven by hybrid electromagnetic and electrothermal actuation mechanisms

Recent Progress in Silicon‐Based Photonic Integrated Circuits and Emerging Applications

Design and fabrication of all-polymer thermo-optic variable optical attenuator with low power consumption

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