A 1/2.8-inch 24Mpixel CMOS image sensor with 0.9μm unit pixels separated by full-depth deep-trench isolation

Kim, Yitae; Choi, Wonsuk; Park, Donghyuk; Jeoung, Heegeun; Kim, Bum Suk; Oh, Youngsun; Oh, Sang‐Hwan; Park, Byung‐Jun; Kim, Euiyeol; Lee, YunKi; Jung, Taesub; Kim, Yong-Woon; Yoon, Suk-Ki; Hong, Sanghyun; Lee, Jesuk; Jung, Sungmoon; Moon, Cheol; Park, Yongin; Lee, Duck‐Hyung; Chang, Donghoon

doi:10.1109/isscc.2018.8310195

Cited by 16 publications

(9 citation statements)

References 2 publications

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“…Image sensors have been rapidly developed for decades and widely used in many different fields [1,2]. To achieve high resolution, the pixel size has been scaled down to 1 µm for mass production [3]. Nevertheless, the pixel size has to be further reduced to meet the growing demand for higher resolution.…”

Section: Dear Editormentioning

confidence: 99%

A centripetal collection image sensor (CCIS) based on back gate modulation achieving 1T submicron pixel

Liu

et al. 2021

Sci. China Inf. Sci.

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Section: Dear Editormentioning

confidence: 99%

A centripetal collection image sensor (CCIS) based on back gate modulation achieving 1T submicron pixel

Liu

et al. 2021

Sci. China Inf. Sci.

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“…CMOS image sensors have gained a lot of attention due to their low power consumption and high frame rate. In the field of aerial mapping, astronomical observation, and other applications, high-resolution CMOS image sensors are needed to obtain clearer object details [ 1 , 2 , 3 , 4 ]. In 2D CMOS image sensors, a high resolution implies a larger pixel array and a larger chip area.…”

Section: Introductionmentioning

confidence: 99%

Synchronous Driving Method for Stitching Pixel Arrays Based on an Adaptive Correction Technique

Liu,

Guo,

Cheng

et al. 2024

Sensors

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With the application of stitching technology in large-pixel-array CMOS image sensors, the problem of non-synchronized output signals from pixel array bilateral driver circuits has become progressively more serious and has led to the DC perforation of bilateral driver circuits, while conventional clock tree synchronization design methodology does not apply to stitching technology. Therefore, this paper analyses reasons for the inconsistency in the output signals of bilateral driving circuits and proposes a synchronous driving method applicable to stitching pixel arrays based on the idea of on-chip output signal delay detection and calibration. This method detects and corrects the non-synchrony of the row driver output signals on both sides according to changes in the operating environment of the chip. This method is characterized by a simple structure and high reliability. Finally, based on the 55 nm stitching process, simulations are carried out in a CMOS image sensor with a chip area of 77 mm × 84 mm to verify that this method is feasible. This large image sensor with a 150 M pixel array has a frame rate of over 10 FPS.

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“…In order to obtain a high resolution image, the pixel pitch is getting smaller and this has to deal with the reduction of Full Well Capacitor (FWC), sensitivity, Signal to Noise Ratio (SNR), etc. [2]. This negatively affect images in dark environments.…”

Section: Introductionmentioning

confidence: 99%

World's first 16:4:1 triple conversion gain sensor with all-pixel AF for 82.4dB single exposure HDR

ChangHyun¹,

Lee²,

EunSub³

et al. 2022

Self Cite

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A Triple Conversion Gain (TCG) sensor with all-pixel auto focus based on 2PD of 1.4 um-pitch has been demonstrated for mobile applications. TCG was implemented by sharing adjacent Floating Diffusion (FD) without adding other capacitor. TCG helps to reduce the noise gap or slow the noise increase as user gain increases. An image with a Dynamic Range (DR) of 82.4 dB through a single exposure can be obtained through intra-scene TCG (i-TCG).Through this, a wider range of illuminance environments can be captured in the image. In addition, a more natural image can be obtained by reducing the SNR dip in one image by using TCG.

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A 1/2.8-inch 24Mpixel CMOS image sensor with 0.9μm unit pixels separated by full-depth deep-trench isolation

Cited by 16 publications

References 2 publications

A centripetal collection image sensor (CCIS) based on back gate modulation achieving 1T submicron pixel

A centripetal collection image sensor (CCIS) based on back gate modulation achieving 1T submicron pixel

Synchronous Driving Method for Stitching Pixel Arrays Based on an Adaptive Correction Technique

World's first 16:4:1 triple conversion gain sensor with all-pixel AF for 82.4dB single exposure HDR

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