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Watanabe, Tetsu; Okane, Isao; Sasabe, Ken

doi:10.2207/qjjws1943.48.611

Cited by 2 publications

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“…From above results, it is demonstrated that the outermost Ni layer in the Al=Ni film shows a good wettability for solders on both-side interface, which is consistent with the fact that the contact angle of molten Sn for Ni is small (∼17°). 26,27) By contrast, in the Althickening specimens, the trace of the outermost Al layer seems to be indistinct, and the layer thickness is not uniform. These characteristics are remarkable especially on the top side; that is, it could be suggested that Al diffuses into Sn more on the top side than on the bottom side.…”

Section: Resultsmentioning

confidence: 92%

Effect of thickening outermost layers in Al/Ni multilayer film on thermal resistance of reactively bonded solder joints

Kanetsuki

Kuwahara

Egawa

et al. 2017

Jpn. J. Appl. Phys.

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To reduce the thermal resistance of solder joints obtained by Al/Ni self-propagating exothermic reaction, we focus on the interface between the solder and the reactive Al/Ni multilayer before the reaction. We fabricate an Al/Ni film in which the outermost Al or Ni layer is deposited more thickly. By the laser flash method with response function analysis, the thermal resistance of the bonded specimens was measured in the case of thickening and non-thickening of the outermost layer. It is found that the resistance decreases with the thickness of the outermost layers, particularly the Ni layer. To investigate the influence of the amount of void on the resistance, scanning acoustic tomography (SAT), scanning electron microscope (SEM) observation, and field-emission electron probe micro-analysis (FE-EPMA) were carried out. Differences in the interfacial state between Ni-thickening and Al-thickening specimens are discussed in light of solder wettability, diffusion into the solder, and the type of intermetallic compound at the solder interface. It can be considered that thickening the outermost Ni layer has a great impact on decreasing the number of voids generated at the AlNi–solder interface even in low-pressure bonding, leading to reduction in the thermal resistance of solder joints.

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Section: Resultsmentioning

confidence: 92%

Effect of thickening outermost layers in Al/Ni multilayer film on thermal resistance of reactively bonded solder joints

Kanetsuki

Kuwahara

Egawa

et al. 2017

Jpn. J. Appl. Phys.

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“…This indicates that Ni easily diffused into the SnAg solder layer because Ni has good chemistry with Sn. (18,22,23) In the as-sputtered Al/Ni joint, Ni diffused more under higher pressure loads in bonding. This indicates that higher pressure loads caused a higher heat conduction efficiency from Al/Ni to the solder.…”

Section: Resultsmentioning

confidence: 99%

Effect of Free-standing Al/Ni Exothermic Film on Thermal Resistance of Reactively Bonded Solder Joint

Kanetsuki¹,

Miyake²,

Namazu³

2019

Sensors and Materials

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In this study, a free-standing Al/Ni exothermic multilayer is fabricated and used as a heat source for reactive soldering, instead of an Al/Ni film directly deposited on the solder layer. The free-standing film enables us to reduce not only cracking in the reacted NiAl layer but also voiding at the NiAl-solder interface. These positive effects have successfully resulted in the reduction in the thermal resistance of the joint. Electron probe microanalysis (EPMA) and electron backscattering diffraction (EBSD) analyses suggest that reducing the thermal resistance has been caused by mechanical strain originating from volume shrinkage induced by the Al/Ni exothermic reaction as well as heat conduction from the reactive film to the solder layer. The mechanism of reducing the number of voids is discussed in light of stress distribution during reactive bonding.

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Cited by 2 publications

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Effect of thickening outermost layers in Al/Ni multilayer film on thermal resistance of reactively bonded solder joints

Effect of thickening outermost layers in Al/Ni multilayer film on thermal resistance of reactively bonded solder joints

Effect of Free-standing Al/Ni Exothermic Film on Thermal Resistance of Reactively Bonded Solder Joint

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