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Wu, Ping; Jin, Huixin; Liu, Hong Lin

doi:10.1023/a:1023227726751

Cited by 4 publications

(2 citation statements)

References 5 publications

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“…In particular, the crystallographic orientation index 45 M(220) for NPs obtained by electroless deposition is found to be 2.55, which is markedly different from the corresponding value (0.93) of NPs obtained by electrodeposition. Since the surface energies of the three planes follow the ordering of Au(111) < Au(100) < Au(110), the Au(111) is therefore the most stable growth plane in both cases. If the adhesion (i.e., the formation of Au x Si) between Au(110) and Si is stronger than that between Au(100) and Si and their difference in adhesion energy is larger than their corresponding difference in surface energy, then the (110) plane would require less energy and therefore be favored in the electroless deposition over the (100) plane.…”

Section: Resultsmentioning

confidence: 98%

Interfacial Bonding of Gold Nanoparticles on a H-terminated Si(100) Substrate Obtained by Electro- and Electroless Deposition

et al. 2007

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Dome-shaped gold nanoparticles (with an average diameter of 10.5 nm) are grown on H-terminated Si(100) substrates by simple techniques involving electro- and electroless deposition from a 0.05 mM AuCl3 and 0.1 M NaClO4 solution. XPS depth profiling data (involving Au 4f core-level and valence band spectra) reveal for the first time the formation of gold silicide at the interface between the Au nanoparticles and Si substrate. UV-visible diffuse reflectance spectra indicate that both samples have surface plasmon resonance maxima at 558 nm, characteristic of an uniform distribution of Au nanoscale particles of sufficiently small size. Glancing-incidence XRD patterns clearly show that the deposited Au nanoparticles belong to the fcc phase, with the relative intensity of the (220) plane for Au nanoparticles obtained by electroless deposition found to be notably larger than that by electrodeposition.

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Section: Resultsmentioning

confidence: 98%

Interfacial Bonding of Gold Nanoparticles on a H-terminated Si(100) Substrate Obtained by Electro- and Electroless Deposition

et al. 2007

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“…However, it is too difficult to get both the metal and polymer to “break” at the same point. This methodology is standard within the field and other results have been published. , …”

Section: Introductionmentioning

confidence: 99%

Theoretical Study on Polyimide−Cu(100)/Ni(100) Adhesion

et al. 2006

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The interfacial properties of polyimide (PI)/M(100) (M = Cu and Ni) were investigated using density functional theory (DFT). A PMDA-ODA monomer unit was used to represent the full PI and the surface was represented by periodically repeated slabs. PI prefers the bridge and top sites on a Cu(100) surface but only forms weak CO−Cu interactions. PI favors the bridge site on a Ni(100) surface and can form strong C−Ni, N−Ni, and CO−Ni bonds. The adsorption energies of PI on Cu(100) and Ni(100) surfaces are −0.58 and −4.7 eV, respectively. Compared to the adsorption energies of O and O2 on a Cu(100) surface, the adsorption of PI on Cu(100) is not energetically favorable, which leads to the easy oxidation of Cu particles in a Cu/PI nanocomposite. The good adhesion at PI/Ni(100) suggests that Ni is a better candidate as a metal filler compared to Cu in the metal−polyimide composite.

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