2010 International Electron Devices Meeting 2010
DOI: 10.1109/iedm.2010.5703389
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9nm half-pitch functional resistive memory cell with &#38;#60;1&#x00B5;A programming current using thermally oxidized sub-stoichiometric WO<inf>x</inf> film

Abstract: Record 9nm half-pitch functional Transition-Metal-Oxide based Resistive Random Access Memory (TMO-RRAM) cell and the lowest reported 1A programming current (I prog , both Set and Reset) have been achieved with thermally oxidized sub-stoichiometric WO x and Nano Injection Lithography (NIL) technique [1]. The unexpectedly low programming current at 9nm diameter has been examined in-depth, it offers potential for scaling low power non-volatile memory. This small device shows Reset/Set resistance ratio around 10,… Show more

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Cited by 31 publications
(10 citation statements)
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“…[3][4][5][6] To fulfill the increasing demand for low cost and higher density memory, the most obvious way to increase the storage capacity is by decreasing the physical size of the device to a nanoscale dimensions, and in RRAM the scalability down to 10 nm has been demonstrated. 7,8 Other interesting approach is to stack the devices 3-dimensionally, for which two feasible architectures of crossbar and vertical RRAM are reported. 9 However, both the methods require complex experimental processes and may suffer from other limitations.…”
mentioning
confidence: 99%
“…[3][4][5][6] To fulfill the increasing demand for low cost and higher density memory, the most obvious way to increase the storage capacity is by decreasing the physical size of the device to a nanoscale dimensions, and in RRAM the scalability down to 10 nm has been demonstrated. 7,8 Other interesting approach is to stack the devices 3-dimensionally, for which two feasible architectures of crossbar and vertical RRAM are reported. 9 However, both the methods require complex experimental processes and may suffer from other limitations.…”
mentioning
confidence: 99%
“…12,13 A recent theoretical study has highlighted the necessity of sub-stoichiometric hafnium oxide for uniform nucleation and growth of conducting filaments during the forming process. 14 In general, resistive switching in different non-stoichiometric metal oxides exhibits improved device performance like low programming currents, 15 better retention, 16 forming free switching, 17 and higher on/off ratio. 18 Engineering devices with an embedded oxygen deficient layer serving as an oxygen vacancy reservoir in TiO x is reported to improve switching performance including forming-free switching.…”
mentioning
confidence: 99%
“…The development of crossbar memory structures based on RRAM technology may result in feasible and innovative solutions to effective non-volatile multipliers [19,20]. Among different types of NVMs, RRAM has shown great potential in the in-memory applications due to its merits such as nanometers cell dimension [18,28,29], nanoseconds switching speed [19,30,31], and microampere of read-write current with a low operation voltage [20,32,33]. Furthermore, it has a high OFF/ON resistance ratio [17,34,35] and good reliability, including data retention and cycle endurance [21,36,37].…”
Section: Resistive Non-volatile Memorymentioning
confidence: 99%