800 Gbps Fully Integrated Silicon Photonics Transmitter for Data Center Applications

Yu, Haijiang; Patel, David; Liu, Wei; Malinge, Yann; Doussière, P.; Lin, Wenhua; Gupta, Sanjeev; Narayanan, K.; Hoshino, Isako; Bresnehan, Michael S.; Sunkoju, Sravan; Mantegazza, D.; Herrick, Robert; Venables, Ranju; Mahalingam, Hari; Seddighian, Pegah; Fuerst, Avi; Davis, Jordan P.; Gold, David L.; Xing, Puyuan; Al‐hemyari, Kadhair; Agrawal, Ankur; Li, Yang; Zheng, Xin; Geethachar, Mala; Favaro, Michael; Zhu, Daniel; Liu, Ansheng; Akulova, Y.A.

doi:10.1364/ofc.2022.m2d.7

Cited by 22 publications

(7 citation statements)

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“…Having the heterogeneously integrated silicon lasers in its portfolio, Intel has shipped 100 Gb/s CWDM4 (Coarse Wavelength Division Multiplexing 4) transceivers over one million units annually, and several new products are ramping, such as 200G FR4 and 400G DR4 pluggable transceivers [100,101]. In 2022, optical transceivers with integrated lasers with a capacity of 800G are demonstrated, which comprised of an 8-channel transmitter with 100Gbps Mach-Zehnder Interferometer modulators (MZM) and on-chip high-power DFB lasers [103]. A large-scale two-dimensional OPA with complex far-field patterns.…”

Section: Optical Communication and Interconnectsmentioning

confidence: 99%

Prospects and applications of on-chip lasers

Zhou

Fang

et al. 2023

eLight

105

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Integrated silicon photonics has sparked a significant ramp-up of investment in both academia and industry as a scalable, power-efficient, and eco-friendly solution. At the heart of this platform is the light source, which in itself, has been the focus of research and development extensively. This paper sheds light and conveys our perspective on the current state-of-the-art in different aspects of application-driven on-chip silicon lasers. We tackle this from two perspectives: device-level and system-wide points of view. In the former, the different routes taken in integrating on-chip lasers are explored from different material systems to the chosen integration methodologies. Then, the discussion focus is shifted towards system-wide applications that show great prospects in incorporating photonic integrated circuits (PIC) with on-chip lasers and active devices, namely, optical communications and interconnects, optical phased array-based LiDAR, sensors for chemical and biological analysis, integrated quantum technologies, and finally, optical computing. By leveraging the myriad inherent attractive features of integrated silicon photonics, this paper aims to inspire further development in incorporating PICs with on-chip lasers in, but not limited to, these applications for substantial performance gains, green solutions, and mass production.

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Section: Optical Communication and Interconnectsmentioning

confidence: 99%

Prospects and applications of on-chip lasers

Zhou

Fang

et al. 2023

eLight

105

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“…Commercial pluggable silicon photonic transceivers have already been introduced to the market by Intel . Recently, 400 Gbps and 800 Gbps fully integrated optical transmitters have been reported by using 4 WDM channels encoded by 100 Gbps pulse amplitude modulation (PAM)-4 signals. Integrated silicon modulators have also been demonstrated with 64 Gbaud signals in both Mach–Zehnder modulators (MZMs) and microring resonator (MRR) modulators .…”

Section: Current Status and Target Performancesmentioning

confidence: 99%

Scalability of Large-Scale Photonic Integrated Circuits

Guo

et al. 2023

ACS Photonics

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To keep up with the growing bandwidth demands, photonic integrated circuits (PICs) have been widely employed in various application scenarios where high capacity and high-bandwidthdensity interconnects are required. However, it is challenging to scale the PICs toward future petabit per second capacity requirements. We study the scalability bottlenecks of PICs in terms of guiding materials, dense integration approaches, wide-band optical sources, and highefficiency tunable and modulation devices. We also look for possible solutions to address these challenges. In the end, we provide a perspective on future PIC development. Moore's law for integrated photonics may last for a much shorter time than that in the microelectronics industry, requiring significant innovations and technological breakthroughs in PIC research.

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“…[2,3] Current silicon photonics optical transceivers carry different data channels at distinct wavelengths using wavelength-division multiplexing (WDM). [4] However, as the industry moves forward with the development of next-generation optical networks, other multiplexing schemes will be required to support a higher data capacity per wavelength channel. One promising approach is the use of spatially-distributed modes to encode more data channels at a specific wavelength combining even orthogonal polarization modes as in current systems with low-loss multiplexer.…”

Section: Introductionmentioning

confidence: 99%

Spatial and Polarization Division Multiplexing Harnessing On‐Chip Optical Beam Forming

González-Andrade

Roux

Aubin

et al. 2023

Laser & Photonics Reviews

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On‐chip spatial and polarization multiplexing has emerged as a powerful strategy to boost the data transmission capacity of integrated optical transceivers. State‐of‐the‐art multiplexers require accurate control of the relative phase or the spatial distribution among different guided optical modes, seriously compromising the optical transmission bandwidth and performance of the devices. To overcome this limitation, a new approach based on the coupling between guided modes in integrated waveguides and optical beams free‐propagating on the chip plane is proposed. The engineering of the evanescent coupling between the guided modes and free‐propagating beams allows spatial and polarization multiplexing with state‐of‐the‐art performance. A two‐polarization multiplexed link and a three‐mode multiplexed link using standard 220‐nm‐thick silicon‐on‐insulator technology have been developed. The two‐polarization link shows a measured −35 dB crosstalk bandwidth of 180 nm, while the three‐mode link exhibits a −20 dB crosstalk bandwidth of 195 nm. These links are used to demonstrate error‐free operation (bit‐error‐rate <10−9) in multiplexing and demultiplexing of two and three non‐return‐to‐zero signals at 40 Gbps each, with power penalties below 0.08 and 1.5 dB for the two‐polarization and three‐mode links, respectively. The approach demonstrated for two polarizations and three modes is transferable to future implementation of more complex multiplexing schemes.

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800 Gbps Fully Integrated Silicon Photonics Transmitter for Data Center Applications

Abstract: A fully integrated 800 Gbps PAM-4 2×FR4 and DR8 silicon photonics transmitter with eight heterogeneously integrated DFB lasers is demonstrated for data center applications over a temperature range of 0~70°C and a reach of up to 2 km.

Cited by 22 publications

References 0 publications

Prospects and applications of on-chip lasers

Prospects and applications of on-chip lasers

Scalability of Large-Scale Photonic Integrated Circuits

Spatial and Polarization Division Multiplexing Harnessing On‐Chip Optical Beam Forming

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