The Proceedings of Conference of Tokai Branch
 2010
DOI: 10.1299/jsmetokai.2010.59.437
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757 Relationship between crack morphology and microstructure in the creep-fatigue crack propagation of lead-free solder

Yusuke Sakagwa
1
,
Takuya Hirasawa
2
,
Keisuke Tanaka
3
et al.
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