2015 IEEE International Solid-State Circuits Conference - (ISSCC) Digest of Technical Papers 2015
DOI: 10.1109/isscc.2015.7062963
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7.5 A 3.3ns-access-time 71.2μW/MHz 1Mb embedded STT-MRAM using physically eliminated read-disturb scheme and normally-off memory architecture

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Cited by 58 publications
(49 citation statements)
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“…2) By replacing volatile working memories such as static random access memories (SRAMs) and dynamic random access memories (DRAMs) by nonvolatile spintronics-based ones, i.e., magnetoresistive random access memories (MRAMs), one can drastically reduce the power consumption of ICs while maintaining high performance as was demonstrated in recent studies. [3][4][5][6][7][8] Spintronics memory devices can be classified into two categories according to their structure: two-and three-terminal devices. Both devices generally include a magnetic tunnel junction (MTJ), and the read operation is performed using the tunnel magnetoresistance (TMR) effect.…”
Section: Introductionmentioning
confidence: 99%
“…2) By replacing volatile working memories such as static random access memories (SRAMs) and dynamic random access memories (DRAMs) by nonvolatile spintronics-based ones, i.e., magnetoresistive random access memories (MRAMs), one can drastically reduce the power consumption of ICs while maintaining high performance as was demonstrated in recent studies. [3][4][5][6][7][8] Spintronics memory devices can be classified into two categories according to their structure: two-and three-terminal devices. Both devices generally include a magnetic tunnel junction (MTJ), and the read operation is performed using the tunnel magnetoresistance (TMR) effect.…”
Section: Introductionmentioning
confidence: 99%
“…The silent stores optimization can be used with all NVMs. But since STT-RAM are quite mature as test chips already exist [4], [5] and show reasonable performance at device level compared to SRAM, we consider STT-RAM in this work.…”
Section: Introductionmentioning
confidence: 99%
“…Although memory cells of STT-MRAM LLCs do not consume leakage power due to their non-volatility, their peripheral circuits are still suffering from the leakage problem [4]. Because STT-MRAM cells are twice or more denser than SRAM cells [5], the number of transistors for peripheral circuits of STT-MRAM LLC is larger than that of SRAM LLC even if the both LLCs occupy the same area.…”
Section: Introductionmentioning
confidence: 99%
“…Therefore, large sized and leaky transistors are required for peripheral circuits including write buffers, writebitline selectors and word line drivers. Thus, saving the leakage power of peripheral circuits is considered as one of the most critical problems of STT-MRAM LLCs in the industry [4].…”
Section: Introductionmentioning
confidence: 99%
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