63.1: Flip Chip Assembly of Panel-Sized TFT-LCD Scan Drivers with Electroless-Plated Bumps Using Anisotropic Conductive Films

Noda, S.; Toba, T.; Hayama, Hiroshi

doi:10.1889/1.2036364

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2006

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“…5V) and highvoltage (ex. 40V) CMOS TFTs, and need very uniform bumping technology (1,2). In addition, Panel-sized column drivers need precise tiny digital analog converters (DACs) and very low resistivity interconnections (3).…”

Section: Introductionmentioning

confidence: 99%

Panel-Sized LCD Drivers Using SOG Technology

Hayama¹

2006

ECS Trans.

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Panel-sized drivers for medium- to large-sized LCDs has been proposed. They are TFT-LSIs fabricated on glass substrates whose length is nearly equal to the width or height of an LCD, and they have long narrow shapes and identical outputs for scan/column lines of the LCD. Scan- and column- driver prototypes have successfully been developed using System-on-glass technology for XGA amorphous silicon TFT-LCD panels.

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Section: Introductionmentioning

confidence: 99%