60 GHz digitally controllable and sequentially rotated fed antenna array

Abstract

Sixteen-chain sequentially rotated fed antenna array on low-temperature cofired ceramic substrate is presented. A 60 GHz broadband circular polarised (CP) stacked rectangular patch antenna is implemented as an element. All the feedlines have the same length which is differentiated from conventional T-junction divider feeder. By this way, several drawbacks of conventional sequential rotated array can be overcome such as phase error occurrence, amplitude mismatch, and axial ratio bandwidth degradation. Moreover, digitally controlled by phase shifters, beamforming performance can be evaluated. The simulated and measured S 11 shows broad bandwidth from 57 to 66 GHz. In addition, the radiation patterns show a peak gain of 17.2 dBi and a wide coverage of ±63°.

28 GHz metal cavity‐backed twin arc slot antenna for high efficiency and thermal management

“…The proposed antenna is implemented with four layers from layers 7 to 10. It is two layers less than a conventional stacked patch antenna, and this reduced number of layers is related to the cost of mass production 4 . In Figure 4A, layer structures of the antennas are compared.…”

“…5G system developments are being accelerated by the standardization activities of many research groups 1,2 . One of the new 5G radio interfaces uses millimeter wave (mmWave) frequencies, which have greater spectral availability 3‐5 . Although many studies have been conducted on mmWave 5G, many technical issues must be overcome, such as propagation characteristics and thermal problems.…”

D-Band 4 × 4 Multi-Feed Array Antenna-in-Package for High-Power Combining and Polarization Synthesis

“…The proposed antenna is designed as a multilayered printed circuit board (PCB) and can be interconnected using mmWave radio-frequency integrated circuits (RFIC). Most antennas for silicon-based mmWave modules are designed and integrated using a multilayered fabrication process with RFIC interconnec- tions [11]- [17]. Antenna-in-package (AiP) structures enable interconnection loss reduction, effective packaging, and reliable production.…”