5 mW/Gbps hybrid-integrated Si-photonics-based optical I/O cores and their 25-Gbps/ch error-free operation with over 300-m MMF

Yashiki, Kenichiro; Suzuki, Yoshishige; Hagihara, Yoshihiro; Kurihara, Minoru; Tokushima, Masatoshi; Fujikata, Junichi; Ukita, Akio; Takemura, Koichi; Shimizu, Takanori; Okamoto, Daisuke; Ushida, Jun; Takahashi, Shigeki; Uemura, Toshinori; Okano, Makoto; Tsuchida, Junichi; Nedachi, Takaaki; Fushimi, Makoto; Ogura, I.; Inasaka, Jun; Kurata, K.

doi:10.1364/ofc.2015.th1g.1

Cited by 41 publications

(7 citation statements)

References 4 publications

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“…Our developed optical transceiver, which we call "optical I/O core", is shown in Fig. 1 [3]. The optical I/O core has a small footprint of 5 × 5 mm 2 and a maximum capacity of 300 Gbps (25 Gbps × 12 channels).…”

Section: Design and Structure Of Optical I/o Corementioning

confidence: 99%

Fingertip-Size Optical Module, “Optical I/O Core”, and Its Application in FPGA

Nakamura

Yashiki²,

Mizutani

et al. 2019

IEICE Trans. Electron.

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Optical I/O core based on silicon photonics technology and optical/electrical assembly was developed as a fingertip-size optical module with high bandwidth density, low power consumption, and high temperature operation. The advantages of the optical I/O core, including hybrid integration of quantum dot laser diode and optical pin, allow us to achieve 300-m transmission at 25 Gbps per channel when optical I/O core is mounted around field-programmable gate array without clock data recovery.

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Section: Design and Structure Of Optical I/o Corementioning

confidence: 99%

Fingertip-Size Optical Module, “Optical I/O Core”, and Its Application in FPGA

Nakamura

Yashiki²,

Mizutani

et al. 2019

IEICE Trans. Electron.

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“…This result coincides with the fact that EF had a wide misalignment tolerance. Bit error rate (BER) characteristics, including B-to-B transmis- [10] were also obtained.…”

Section: Transmission Characteristicsmentioning

confidence: 99%

25-Gbps/ch Error-Free Operation over 300-m MMF of Low-Power-Consumption Silicon-Photonics-Based Chip-Scale Optical I/O Cores

Yashiki

Uemura

Kurihara

et al. 2016

IEICE Trans. Electron.

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SUMMARYAiming to solve the input/output (I/O) bottleneck concerning next-generation interconnections, 5 × 5-millimeters-squared siliconphotonics-based chip-scale optical transmitters/receivers (TXs/RXs)-called "optical I/O cores"-were developed. In addition to having a compact footprint, by employing low-power-consumption integrated circuits (ICs), as well as providing multimode-fiber (MMF) transmission in the O band and a user-friendly interface, the developed optical I/O cores allow common ease of use with applications such as multi-chip modules (MCMs) and active optical cables (AOCs). The power consumption of their hybrid-integrated ICs is 5 mW/Gbps. Their high-density user-friendly optical interface has a spot-size-converter (SSC) function and permits the physical contact against the outer waveguides. As a result, they provide large enough misalignment tolerance to allow use of passive alignment and visual alignment. In a performance test, they demonstrated 25-Gbps/ch error-free operation over 300-m MMF.

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“…"Optical I/O core" is the multi-channel arrayed integrated chip-scale OE/EO converter and consists of waveguides (WG), grating couplers (GC), modulators (MOD), spot size converters (SSC) and laser diode (LD) on the transmitter chip and photo detectors (PD) on the receiver chip [6]. "WDM integrated optical I/O chip" is the advanced OE/EO converter with wavelength-divisionmultiplexing (WDM) and consists of MOD, PD, multiplexer (MUX) and de-multiplexer (DeMUX).…”

Section: A Building Blocks For Photonics Platformmentioning

confidence: 99%

A 300mm Si photonics platform for multi-applications

Mogami

Horikawa

Kinoshita

et al. 2015

2015 Opto-Electronics and Communications Conference (OECC)

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A 300mm Si photonics platform has been established for optical multi-applications. For device fabrication process, the advanced CMOS technology can lead to the performance improvement of optical devices. State-of-theart propagation loss values are obtained for optical waveguides of multi-thickness SOI structures in this platform and discussed them theoretically. 50x50mm 2 large Si interposers with photonics electronics convergence technology were demonstrated by using this platform.

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5 mW/Gbps hybrid-integrated Si-photonics-based optical I/O cores and their 25-Gbps/ch error-free operation with over 300-m MMF

Cited by 41 publications

References 4 publications

Fingertip-Size Optical Module, “Optical I/O Core”, and Its Application in FPGA

Fingertip-Size Optical Module, “Optical I/O Core”, and Its Application in FPGA

25-Gbps/ch Error-Free Operation over 300-m MMF of Low-Power-Consumption Silicon-Photonics-Based Chip-Scale Optical I/O Cores

A 300mm Si photonics platform for multi-applications

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