“…In recent years, various techniques of film deposition on Si substrates have been developed for the construction of integrated circuits: Physical vapor deposition (PVD) techniques, such as sputtering and pulsed-laser deposition, chemical vapor deposition (CVD), and chemical solution deposition (CSD), were adopted by many researchers and manufacturers as conventional techniques for the fabrication of Si-based electronic devices. 1,2) Currently, a film deposition technique for achieving very large scale or ultra-largescale integration on Si substrate is required to realize some ideal characteristics as follows: (i) crystallizing the film at a low temperature, (ii) conformal deposition on complexshaped substrates, and (iii) easy and accurate control of chemical composition in multicomponent films. However, none of the conventional techniques for film deposition have satisfied these reqirements simultaneously; in particular, even a direction of the solution has never been clarified in terms of their requirement in (i) film crystallization at a low temperature to prevent the thermal damage of integrated circuits on Si substrate, which is essential for achieving the circuit integration in next-generation devices.…”