Abstract:We present Merck's new formulation and material developments enabling high‐volume and high‐throughput printing techniques to be used for cost‐effective electronic circuitry and backplane production. Performance at TFT array level in excess of 2 cm2/Vs, comparable to spin coating is demonstrated at Gen1 scale and 50 ppi resolution, using a hybrid combination of conventional lithographic steps and direct gravure printing.
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