2015
DOI: 10.1002/vipr.201500596
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40 Jahre industrielles Magnetron‐Sputtern in Europa

Abstract: Im Oktober 1974 wurde die erste durch einen Ringspalt‐Magnet unterstützte Magnetronentladung am damaligen Forschungsinstitut Manfred von Ardenne (IvA) in Dresden ausgeführt. An ähnlichen Entwicklungen wurde zu dieser Zeit auch in anderen europäischen Ländern und den USA gearbeitet. Anlässlich dieses vierzigsten Jubiläums beschreibt der vorliegende Beitrag — mit überwiegendem Blick auf Europa — die Entwicklung der ersten Magnetrons und die antreibenden Faktoren für ihre Weiterentwicklung. Er illustriert den For… Show more

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Cited by 8 publications
(6 citation statements)
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“…High energy ball milling (HEBM) [29,30] is one of the most common methods for silicon alloy preparation because of its simple operation and energy efficiency. With the advancing technology, promising methods have been devised for the synthesis of silicon-based alloys, such as magnetron sputtering (MS), [31,32] pulsed laser deposition (PLD), [33,34] and electron beam evaporation (EBE). [35] The chemical methods include chemical vapor deposition (CVD), [36,37] electrostatic spray deposition (ESD), [38] and spin-coating technique.…”
Section: Synthesis Of Silicon-based Alloysmentioning
confidence: 99%
“…High energy ball milling (HEBM) [29,30] is one of the most common methods for silicon alloy preparation because of its simple operation and energy efficiency. With the advancing technology, promising methods have been devised for the synthesis of silicon-based alloys, such as magnetron sputtering (MS), [31,32] pulsed laser deposition (PLD), [33,34] and electron beam evaporation (EBE). [35] The chemical methods include chemical vapor deposition (CVD), [36,37] electrostatic spray deposition (ESD), [38] and spin-coating technique.…”
Section: Synthesis Of Silicon-based Alloysmentioning
confidence: 99%
“…Finally, the target is vaporized and the vapors are deposited on the substrate, creating a thin atomic layer. The entire procedure takes place in a vacuum chamber in the presence of low pressure plasma (0.67 Pa) [66].…”
Section: Sonochemical and Microwave-assisted Methodsmentioning
confidence: 99%
“…Approximately 50 years ago, the development of sputtering technology progressed greatly and was characterized by successes in improving deposition rates, process stability, and cost efficiency in the following years. At present, magnetron sputtering is widely known as a reliable and cost‐effective coating process that has already become established in numerous industries [8]. The MSIP‐PVD process is also known as cathode sputtering and can be used for the deposition of metallic coatings (e.g., Ti, Al, Cr), nitride coatings (e.g., CrAlN, TiAlN, TiN, CrN), or oxide ceramic coatings (e.g., Al 2 O 3 , Cr 2 O 3 ).…”
Section: Magnetron Sputter Ion Plating (Msip)mentioning
confidence: 99%