3DP process for fine mesh structure printing

Effect of Gray Scale Binder Levels on Additive Manufacturing of Porous Scaffolds with Heterogeneous Properties

“…Research groups have generally focused on the tuning and optimization of powder‐based AM process parameters to control the chemical, structural, and mechanical functionality of the resulting parts in order to address the design requirements for bone substitutes. One such AM process parameter is the liquid binder in terms of chemical composition, concentration, and discrete saturation levels on the powder substrate. As such, Vorndran et al .…”

“…Further postprocessing such as thermal annealing may be required to fully cure the part. 1,6 Since its invention, researchers have explored the capabilities of this manufacturing approach in different areas of application, such as smart memory alloys, 7,8 carbon performs, 9 metallurgy tooling, 10 metallic prostheses, 11 and biomedical and tissue engineering scaffolds. [12][13][14][15][16] Overall, the AM process has a great versatility and can be tailored for a wide range of industrial and biomedical applications.…”

Process Development of Porcelain Ceramic Material with Binder Jetting Process for Dental Applications

“…The effect of layer thickness was not investigated due to the existence of previous works. [25][26][27][28][29] The results of this study can be used as a preliminary guideline for adjusting the printing parameters for new material development and the better understanding of the binder jetting processes.…”

Experimental and theoretical investigation on ultra-thin powder layering in three dimensional printing (3DP) by a novel double-smoothing mechanism

“…Consequently, fine powder must be used for the ultra-thin layering. However, according to Lu and Reynolds (2008), the considerable Van der Waals' forces are unavoidable during manipulating fine powder, and this is why CR layering method, in the case of dispensing ultra-thin powder layers, is prone to cause layering defects to degrade the powder-layer integrities. CR layering method is adopted by most commercial 3DP machines owing to its simplicity, so the layer thicknesses designated for the researches using commercial 3DP machines were not very thin: Sun et al (2002) conducted the 3DP freeform fabrication of Ti 3 SiC 2 structures with the layer thickness ranging from approximately 89 m to 180 m; Gill and Kaplas (2011) fabricated the split pattern shells with 125 m layer thickness for the rapid casting of light alloys; and Marchelli et al (2011) explored the 3DP glass fabrication with the layer thickness ranging from 100 m to 215 m.…”