3D Rapid-Prototyped 21-31-GHz Hollow SIWs for Low-Cost 5G IoT and Robotic Applications

Abstract

This article presents, for the first time, new design and fabrication techniques for Hollow Substrate Integrated Waveguides (HSIWs), demonstrated in the nominal frequency from 21 to 31 GHz, for use in wireless communication applications such as 5G, IoT and robotics. The design and fabrication techniques introduced in this paper feature: 1) the use of low-cost rapid prototyping additive manufacturing based on polymer jetting (PJ), and 2) the use of commercially available through-substrate copper via transitions. In contrast to the conventional SIW designs and fabrications, this new approach does not rely on through-substrate via fabrication, hence avoiding some difficult manufacturing steps, such as through-substrate etching, via formation and via metallization, which are considered complex and expensive to implement. The 3D printed HSIWs in this article can achieve a propagation loss of lower than 1.56 Np/m (13.55 dB/m), which is considered one of the results with the lowest propagation loss achieved to date, when compared to the state-of-the-art.

A Controllable Planar Wideband Bandpass Filters using the Combination of Microstrip and Substrate Integrated Waveguide Structure

“…where D is the diameter of the metal vias, w represents their transverse spacing and P is spacing between two vias [7][8][9]. Besides, to maintain the good impedance matching on the connection between SIW and microstrip structure, the taper transition line is added and adjusted [1].…”

“…To create BPFs, many structure types are used such as coaxial, waveguide, microstrip, and etc. Recently, a substrate integrated waveguide (SIW) has been introduced [1][2][3][4]. It is easily synthesized by introducing two rows of metalized holes into the substrate layer of printed circuit board (PCB).…”

THz Photo-Polymeric Lens Antennas for Potential 6G Beamsteering Frontend

“…3D printing technology offers several advantages, such as rapid prototyping, low material and manufacturing costs, and lightweight. Various 3D printing techniques, e.g., fused deposition modeling (FDM), polymer jetting (PolyJet), digital light processing (DLP), and stereolithography apparatus (SLA), are mostly used for design and fabricating in microwave, millimeter-wave, and up to THz components [3]- [5]. The FDM is the lowest printing resolution, which is limited by the filament and nozzle sizes.…”

“…The PJ technique performs the 3D patterned structure like an inkjet printing technique. In this paper, the DLP technique was chosen for design and fabricating the 3D-printed hemispherical lens antennas because the resolution of this technique is suitable for operating at the WR-10 bands [5].…”

A Novel 24-GHz Miniaturized Flexible Rectifier for Wireless Energy Harvesting

“…A compact and efficient rectifier circuit is the major requirement for an effective wireless power transfer system [2]. Nowadays most of the research efforts [3]- [12] are focused on the miniaturization and enhancement the performance of the antennas for improving the RF-DC conversion efficiency, specifically for flexible substrate materials [13]- [18].…”