Various three-dimensional (3D) printing methods are being employed to optimize results in terms of rapid prototyping, cost-effectiveness, waste reduction, and properties of printed objects, among other factors. The use of composite materials in 3D printing significantly enhances mechanical, wear, and thermal properties. However, when dealing with thermodynamically immiscible composite systems, maintaining a homogeneous dispersion can be challenging. To address this challenge, two techniques have been utilized for the copper (Cu)-hexagonal boron nitride(hBN) immiscible system: one is laser melting-based, i.e., selective laser melting (SLM), and the other is ink-based printing, i.e., direct ink writing (DIW) with postprocessing sintering of the printed object to tailor the dispersion and interface between copper and hexagonal boron nitride (hBN). To facilitate the DIW process, a customized Cu-hBN composite ink was meticulously prepared by optimizing its rheological properties. Similarly, a mechanical mixture of copper and hexagonal boron nitride pellets underwent laser melting to form solid objects. Optical and scanning electron microscopy techniques reveal the surface morphology and the good distribution of hexagonal boron nitride within the copper matrix in both cases. The mechanical properties of the composites were assessed through micro-Vickers hardness testing, compression tests, and tribological analysis. Compression fracture morphologies of both processing techniques were examined. Through the SLM process, pores can be eradicated, whereas in the DIW process, the pore size can be tailored through DIW parameters and subsequent sintering parameters. Both selective laser melting and direct ink writing processed Cu-hBN composites show improved electrical conductivity compared with pure copper. Direct ink writing processed 2 wt %hBN shows better thermal conductivity than other investigated composites. Among selective laser melting and direct ink writing composites, Cu-1 wt %hBN shows higher YS of 32 and 22 MPa, respectively.