“…This method has been widely used to fabricate liquid metal microchannels, antennas, [34][35][36][37][38][39] sensors, [40][41][42][43][44][45][46][47][48][49][50][51] electronics, 49,[52][53][54][55][56][57] conductors, 51,58,59 and 3D structures. [60][61][62] However, this method has some limitations, such as the need for extremely high pressure (B10 MPa) to fill a narrow channel (150 nm in width) or the possibility of trapping air, which can prevent the channel from being filled with the metal. The channel should also have an outlet to allow air to escape during liquid metal injection into the inlet.…”