2024 47th International Spring Seminar on Electronics Technology (ISSE) 2024
DOI: 10.1109/isse61612.2024.10603755
|View full text |Cite
|
Sign up to set email alerts
|

3D Printed Circuit Boards from Recycled Plastics: Interconnection Properties

Jakub Zdráhal,
Markéta Klimtová,
Iva Králová
Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

0
0
0

Publication Types

Select...

Relationship

0
0

Authors

Journals

citations
Cited by 0 publications
references
References 18 publications
0
0
0
Order By: Relevance

No citations

Set email alert for when this publication receives citations?