3D Printed and Photonically Cured Graphene UHF RFID Tags on Textile, Wood, and Cardboard Substrates

Akbari, Mitra; He, Han; Juuti, Jari; Tentzeris, Manos M.; Virkki, Johanna; Ukkonen, Leena

doi:10.1155/2017/7327398

Cited by 16 publications

(7 citation statements)

References 12 publications

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“…The advantages are remarkable: the heat treatment takes place in milliseconds, producing minimal damage to low-temperature substrates and avoiding unwanted processes (diffusion) [42]. FLA was employed in different kind of applications ranging from thin-film transistors [44], solar cells [45], antennas [46], RFID components [47,48] to wearable devices [49], using conductive, bioresorbable or ceramic inks (silicon, silver, zinc) on different kind of substrates (wood, cardboard, textiles, glass, polymers) [50,51].…”

Section: Introductionmentioning

confidence: 99%

Printed Smart Devices on Cellulose-Based Materials by means of Aerosol-Jet Printing and Photonic Curing

Serpelloni

Cantù

Borghetti

et al. 2020

Sensors

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Printed electronics is an expanding research field that can reach the goal of reducing the environmental impact on electronics exploiting renewable and biodegradable materials, like paper. In our work, we designed and tested a new method for fabricating hybrid smart devices on cellulose substrates by aerosol jet printing (AJP) and photonic curing, also known as flash lamp annealing (FLA), capable to cure low temperature materials without any damage. Three different cellulose-based materials (chromatographic paper, photopaper, cardboard) were tested. Multilayer capability and SMDs (surface mount devices) interconnections are possible permitting high flexibility in the fabrication process. Electrical and geometrical tests were performed to analyze the behavior of printed samples. Resulted resistivities are 26.3 × 10−8 Ω⋅m on chromatographic paper, 22.3 × 10−8 Ω⋅m on photopaper and 13.1 × 10−8 Ω⋅m on cardboard. Profilometer and optical microscope evaluations were performed to state deposition quality and penetration of the ink in cellulose materials (thicknesses equal to 24.9, 28.5, and 51 μm respectively for chromatographic paper, photopaper, and cardboard). Furthermore, bending (only chromatographic paper did not reach the break-up) and damp environment tests (no significant variations in resistance) where performed. A final prototype of a complete functioning multilayer smart devices on cellulose 3D-substrate is shown, characterized by multilayers, capacitive sensors, SMDs interconnections.

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Section: Introductionmentioning

confidence: 99%

Printed Smart Devices on Cellulose-Based Materials by means of Aerosol-Jet Printing and Photonic Curing

Serpelloni

Cantù

Borghetti

et al. 2020

Sensors

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show abstract

“…The resulting component was used as a triboelectric nano-generator for the harvesting of biomechanical energy from human motion and achieved a power density as high as 18 mW/m2. In addition, researchers [ 168 , 169 , 170 , 171 , 172 , 173 , 174 ], studied the performance, application, and effects of 3D printer electronic integrated in the textile substrate. Additionally, 3D printing was used for the integration of electronics with high performance.…”

Section: Integration Techniquesmentioning

confidence: 99%

Review on the Integration of Microelectronics for E-Textile

et al. 2021

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Modern electronic textiles are moving towards flexible wearable textiles, so-called e-textiles that have micro-electronic elements embedded onto the textile fabric that can be used for varied classes of functionalities. There are different methods of integrating rigid microelectronic components into/onto textiles for the development of smart textiles, which include, but are not limited to, physical, mechanical, and chemical approaches. The integration systems must satisfy being flexible, lightweight, stretchable, and washable to offer a superior usability, comfortability, and non-intrusiveness. Furthermore, the resulting wearable garment needs to be breathable. In this review work, three levels of integration of the microelectronics into/onto the textile structures are discussed, the textile-adapted, the textile-integrated, and the textile-based integration. The textile-integrated and the textile-adapted e-textiles have failed to efficiently meet being flexible and washable. To overcome the above problems, researchers studied the integration of microelectronics into/onto textile at fiber or yarn level applying various mechanisms. Hence, a new method of integration, textile-based, has risen to the challenge due to the flexibility and washability advantages of the ultimate product. In general, the aim of this review is to provide a complete overview of the different interconnection methods of electronic components into/onto textile substrate.

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“…The resulting component was used as a triboelectric nano generator for the harvesting of biomechanical energy from human motion and achieved a power density as high as 18 mW/m2. In addition, researchers [150][151][152][153][154][155][156], studied the performance, application, and effects of 3D printer electronic integrated in the textile substrate. 3D printing was used for the integration of electronics with high performance.…”

Section: Three-dimensional (3d) Printingmentioning

confidence: 99%

Review on the Integration of Microelectronics for E-textile

Simegnaw¹,

Malengier²,

Gideon³

et al. 2021

Preprint

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Modern electronic textiles are moving towards flexible wearable textiles, so-called e-textiles that have micro-electronic elements embedded onto the textile fabric that can be used for varied classes of functionalities. There are different methods of integrating rigid microelectronic components into/onto textiles for the development of smart textiles, which include, but are not limited to, physical, mechanical and chemical approaches. The integration systems must satisfy being flexible, lightweight, stretchable and washable to offer a superior usability, comfortability and non-intrusiveness. Furthermore, the resulting wearable garment needs to be breathable. In this review work, three levels of integration of the microelectronics into/onto the textile structures are discussed, the textile-adapted, the textile-integrated, and the textile-based integration. The textile-integrated and the textile- adapted e-textiles have failed to efficiently meet being flexible and washable. To overcome the above problems, researchers studied the integration of microelectronics into/onto textile at fiber or yarn level applying various mechanisms. Hence, a new method of integration, textile-based, has risen to the challenge due to the flexibility and washability advantages of the ultimate product. In general, the aim of this review is to provide a complete overview of the different interconnection methods of electronic components into/onto textile substrate.

show abstract

3D Printed and Photonically Cured Graphene UHF RFID Tags on Textile, Wood, and Cardboard Substrates

Cited by 16 publications

References 12 publications

Printed Smart Devices on Cellulose-Based Materials by means of Aerosol-Jet Printing and Photonic Curing

Printed Smart Devices on Cellulose-Based Materials by means of Aerosol-Jet Printing and Photonic Curing

Review on the Integration of Microelectronics for E-Textile

Review on the Integration of Microelectronics for E-textile

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