2009 IEEE International Conference on 3D System Integration 2009
DOI: 10.1109/3dic.2009.5306537
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3D on-chip memory for the vector architecture

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Cited by 4 publications
(2 citation statements)
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“…However, there are several researches designing 3-D stacked cache memories, which realize a high memory bandwidth and huge capacity using TSVs [14] [15]. Since TSVs have a small RC delay compared to conventional 2D wires, and recent TSVs process technologies allow to implement many TSVs on a chip [16] 3-D stacked cache memories have potential to realize higher memory bandwidth compared to 2-D implementation [17]. Thus, in this section, we can assume the future 3-D stacked vector cache have a high memory bandwidth of 128GB/sec per core and 256GB/sec per core.…”
Section: Discussionmentioning
confidence: 99%
“…However, there are several researches designing 3-D stacked cache memories, which realize a high memory bandwidth and huge capacity using TSVs [14] [15]. Since TSVs have a small RC delay compared to conventional 2D wires, and recent TSVs process technologies allow to implement many TSVs on a chip [16] 3-D stacked cache memories have potential to realize higher memory bandwidth compared to 2-D implementation [17]. Thus, in this section, we can assume the future 3-D stacked vector cache have a high memory bandwidth of 128GB/sec per core and 256GB/sec per core.…”
Section: Discussionmentioning
confidence: 99%
“…A storage dependency is a type of resource creation and provision dependency that is specific to memory, both on-chip and off-chip. Storage dependencies can be mitigated by implementing the storage in the control plane [8,16,29,35]. …”
Section: Resource Creation and Provision Contentionmentioning
confidence: 99%