3D IPAC — A new passives and actives concept for ultra-miniaturized electronic and bioelectronic functional modules

Abstract

This paper describes an innovative 3D IPAC (Integrated Passive and Active Components) concept for ultraminiaturized and highly-functional sub-systems, going beyond discrete passives and Integrated Passive Devices (IPDs). The 3D IPAC concept consists of an ultra-thin 3D structure made of low loss and ultra-thin glass substrates with small-diameter through-vias, and ultra-thin active devices and thin or thick passive films or thin discrete passives on both sides. The first part of the paper describes the benefits of the 3D IPAC concept. The second part of the paper describes a wireless power telemetry module for a bioelectronic system application, and provides proof-of-concept demonstrations for the thinfilm passive components as a building block in the 3D IPAC telemetry module. Passives Passives Active ICActive IC 978-1-4799-0232-3/13/$31.00 ©2013 IEEE

RF Device Integration on Glass Interposer toward 3D-IPAC Packages

“…Moreover the added cost of thin-film processes is comparable to IPDs on silicon. To address the above challenges, Georgia Tech Packaging Research Center (GT-PRC) has explored a new concept of ultra-miniaturized and highly functional sub-systems, called 3D IPAC [2]. As shown in Fig.…”