2013 IEEE 63rd Electronic Components and Technology Conference 2013
DOI: 10.1109/ectc.2013.6575646
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3D Integration of CMOS image sensor with coprocessor using TSV last and micro-bumps technologies

Abstract: This paper presents the prototype of a 3D circuit in which a Wafer Level Packaged CMOS image sensor is vertically assembled with an image signal processor in a face-to-back integration scheme. The design flow used to hybrydize the two circuits will be fully described, up to physical implementation. The process technology carried out will be presented in a 200 mm environment. Finally, the 3D assembly will be successfully assessed, concretising the realism of a 3D technology for nomadic imaging systems.

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Cited by 15 publications
(4 citation statements)
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“…3D integration allows the integration of routing metal layers and transistor-based circuits required for implementing spatio-temporal computations directly above (or under) the pixel array, similar to the biological retinal circuit. Such 3D integrated IRIS sensors can use various 3D packaging technologies like metal-to-metal fusion bonding (Raymundo et al, 2013), TSVs (Coudrain et al, 2013), etc. Further, heterogeneous sensors operating at different wavelengths can be cointegrated to extract retina-like feature vectors over the different light spectrums.…”
Section: Results: Ld Feature-extraction Circuit Simulations and Varia...mentioning
confidence: 99%
“…3D integration allows the integration of routing metal layers and transistor-based circuits required for implementing spatio-temporal computations directly above (or under) the pixel array, similar to the biological retinal circuit. Such 3D integrated IRIS sensors can use various 3D packaging technologies like metal-to-metal fusion bonding (Raymundo et al, 2013), TSVs (Coudrain et al, 2013), etc. Further, heterogeneous sensors operating at different wavelengths can be cointegrated to extract retina-like feature vectors over the different light spectrums.…”
Section: Results: Ld Feature-extraction Circuit Simulations and Varia...mentioning
confidence: 99%
“…3D integration allows integration of routing metal layers and transistor based circuits required for implementing spatio-temporal computations directly above (or under) the pixel array, similar to the biological retinal circuit. Such 3D integrated IRIS sensors can use various 3D packaging technologies like metal-to-metal fusion bonding 42 , TSVs 43 , etc. Further, heterogeneous sensors operating at different wavelengths can be co-integrated to extract retina-like feature vectors over different spectrum of light.…”
Section: Discussion: Future Work and Broader Impactmentioning
confidence: 99%
“…In theory, this can lead to a FF close to 100%. Recently, a prototype of a 3D-stacked CMOS image sensor with a vertically-assembled image signal processor was successfully realized (Coudrain et al 2013).…”
Section: Photon Detection Efficiencymentioning
confidence: 99%