3D integration of 2D electronics

Jayachandran, Darsith; Sakib, Najam U; Das, Saptarshi

doi:10.1038/s44287-024-00038-5

Cited by 2 publications

(1 citation statement)

References 209 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…van der Waals (vdW) interfaces play crucial roles in the performance and properties of flexible devices using organic semiconductors, conducting polymers, carbon nanotubes, two-dimensional (2D) materials, and so on. − In such systems, numerous vdW interfaces are present, and vdW interfaces significantly influence the performance and properties of flexible devices. Particularly, from the view of thermal management for 2D electronics, the study on heat transfer through vdW interfaces of layered 2D materials is of great importance because of their high heat generation and interfacial thermal mismatches. − For thermoelectric applications using flexible materials, understanding both the thermal and electrical properties across vdW interfaces is highly important. Recent advancements in the interface design through artificial stacking of 2D materials have indicated remarkable thermal and thermoelectric properties at the interfaces, such as ultralow thermal conductance, − stacking angle-dependence of thermal conductance, and interfacial thermopower caused by quantized electronic states through moiré stacking .…”

Section: Introductionmentioning

confidence: 99%

Correlation between the Cross-Plane Thermal and Electrical Conductance in Randomly Stacked MoS₂

Zhou,

Ueji,

Shiga

et al. 2024

ACS Appl. Electron. Mater.

View full text Add to dashboard Cite

van der Waals (vdW) interface is a critical component in the performance of flexible devices, such as electronics, thermal, and thermoelectric devices. Recent advances in interface design with twodimensional (2D) materials have allowed for studying various controlled interface properties. Understanding the heat and charge transport correlation is essential for optimizing flexible device performance. However, due to experimental limitations, the correlation between the heat and charge transport characteristics across 2D vdW interfaces has not yet been elucidated. Here, we revealed the thermal and electrical conductance across four randomly stacked MoS 2 layers. The simultaneous determination of cross-plane thermal and electrical conductance can be achieved using time-domain thermoreflectance measurements using Au as a metal transducer. A linear correlation between thermal and electrical conductance was observed by vacuum annealing, and such behavior can be understood by the change in interlayer distance from theoretical calculations. Our study offers insights into thermal management for nanodevices using stacked 2D materials.

show abstract

Section: Introductionmentioning

confidence: 99%

Correlation between the Cross-Plane Thermal and Electrical Conductance in Randomly Stacked MoS₂

Zhou,

Ueji,

Shiga

et al. 2024

ACS Appl. Electron. Mater.

View full text Add to dashboard Cite

show abstract

2D materials-based crossbar array for neuromorphic computing hardware

Lee,

Park,

Kim

et al. 2024

Neuromorph. Comput. Eng.

View full text Add to dashboard Cite

The growing demand for artificial intelligence has faced challenges for traditional computing architectures. As a result, neuromorphic computing systems have emerged as possible candidates for next-generation computing systems. Two-dimensional (2D) materials-based neuromorphic devices that emulate biological synapses and neurons play a key role in neuromorphic computing hardware due to their unique properties such as high strength, thermal conductivity, and flexibility. Although several studies have shown the simulations of individual devices, experimental implementation of large-scale crossbar arrays is still unclear. In this review, we explore the working principles and mechanisms of memristive devices. Then, we overview the development of neuromorphic devices based on 2D materials including transition metal dichalcogenides, graphene, hexagonal boron nitride, and layered halide perovskites. We also highlight the requirement and recent progress for building crossbar arrays by utilizing the advantageous properties of 2D materials. Lastly, we address the challenges that hardware implementation of neuromorphic computing systems currently face and propose a path towards system-level applications of neuromorphic computing.

show abstract

3D integration of 2D electronics

Cited by 2 publications

References 209 publications

Correlation between the Cross-Plane Thermal and Electrical Conductance in Randomly Stacked MoS₂

Correlation between the Cross-Plane Thermal and Electrical Conductance in Randomly Stacked MoS₂

2D materials-based crossbar array for neuromorphic computing hardware

Contact Info

Product

Resources

About

3D integration of 2D electronics

Cited by 2 publications

References 209 publications

Correlation between the Cross-Plane Thermal and Electrical Conductance in Randomly Stacked MoS2

Correlation between the Cross-Plane Thermal and Electrical Conductance in Randomly Stacked MoS2

2D materials-based crossbar array for neuromorphic computing hardware

Contact Info

Product

Resources

About

Correlation between the Cross-Plane Thermal and Electrical Conductance in Randomly Stacked MoS₂

Correlation between the Cross-Plane Thermal and Electrical Conductance in Randomly Stacked MoS₂