3D EM simulations and analysis of in-package metal plate interconnecting high-side and low-side FETs of DC-DC converter

Abstract

The impact of the metal plate that interconnects the high-side and low-side FETs on the behavior of a synchronous buck converter is analyzed. A 3D model of the integrated voltage regulator and PCB power planes is analyzed in electromagnetic (EM) simulator. The lumped-element model of the plate is extracted. Parametrization of the package and PCB geometry is performed to describe their influence on the plate parasitics. The operation of the converter using the integrated voltage regulator is evaluated by SPICE simulations for several sets of plate parameters to correctly estimate their influence on the resonant frequency and efficiency of the converter.