2021
DOI: 10.3390/nano11113045
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32 × 32 Pixelated High-Power Flip-Chip Blue Micro-LED-on-HFET Arrays for Submarine Optical Communication

Abstract: This work proposes the use of integrated high-power InGaN/GaN multiple-quantum-well flip-chip blue micro light-emitting diode (μ-LED) arrays on an AlGaN/GaN-based heterojunction field-effect transistor (HFET), also known as a high electron mobility transistor (HEMT), for various applications: underwater wireless optical communication (UWOC) and smart lighting. Therefore, we demonstrate high-power μ-LED-on-HEMT arrays that consist of 32 × 32 pixelated μ-LED arrays and 32 × 32 pixelated HEMT arrays and that are … Show more

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Cited by 6 publications
(6 citation statements)
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References 29 publications
(66 reference statements)
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“…161,166 , OSA Open Access Publishing Agreement; ref. 175,184 , Optical Society of America. where N in and N out are the input and output carrier concentrations, respectively.…”
Section: Theory Of Vlc Applicationsmentioning
confidence: 99%
See 1 more Smart Citation
“…161,166 , OSA Open Access Publishing Agreement; ref. 175,184 , Optical Society of America. where N in and N out are the input and output carrier concentrations, respectively.…”
Section: Theory Of Vlc Applicationsmentioning
confidence: 99%
“…Recently, Wei et al fabricated a QD blue μLED with a size of 75 μm for UVLC 175 . The growth-interruption method was employed to fabricate QD active region.…”
Section: Underwater Vlc Technologymentioning
confidence: 99%
“…Monolithic heterogeneous integrated devices are attracting considerable interest. Monolithic integration of μLED and photodetector are not only for displays but also have a wide range of applications in on-chip optical interconnections, photonic chips and visible light communications (VLC) . The integration of photodetectors and μLED results in a compact chip structure that integrates receiving and transmitting ends and is needed to satisfy Moore’s Law .…”
Section: Introductionmentioning
confidence: 99%
“…Based on the outstanding advantages of GaN material performance, the integration of μLED and GaN electronic device driver circuit is expected to realize a highly integrated semiconductor device that combines switching, driving, light-emitting, sensing, detecting and signal transmission functions. [10] In this paper, a homogeneous monolithic integration of BJT and μLED (LET) which it enables optoelectronic co-modulation had been proposed. The BJT has the same GaN material and process fabrication system as the LED.…”
Section: Introductionmentioning
confidence: 99%