International Electron Devices Meeting 2000. Technical Digest. IEDM (Cat. No.00CH37138)
DOI: 10.1109/iedm.2000.904255
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30 nm physical gate length CMOS transistors with 1.0 ps n-MOS and 1.7 ps p-MOS gate delays

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Cited by 89 publications
(62 citation statements)
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“…Table I displays a selected number of electrical characteristics for devices with channel lengths between 15 nm and 36 nm. It is obvious from both, the transconductance data as well as the drive current values that our data compare well with state-of-the-art classical approaches [1], [2]. In contrast to the results from Kedzierski and co-workers [3] on thin body MOSFETs, our V-groove approach does not suffer from high source (or drain) to channel contact resistances.…”
Section: Resultscontrasting
confidence: 38%
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“…Table I displays a selected number of electrical characteristics for devices with channel lengths between 15 nm and 36 nm. It is obvious from both, the transconductance data as well as the drive current values that our data compare well with state-of-the-art classical approaches [1], [2]. In contrast to the results from Kedzierski and co-workers [3] on thin body MOSFETs, our V-groove approach does not suffer from high source (or drain) to channel contact resistances.…”
Section: Resultscontrasting
confidence: 38%
“…This is the case when the channel length becomes comparable to the body thickness of the channel. Simulations of the impact of the body thickness in ultrasmall MOSFETs [9], suggest that significant 1 The effective channel width of the devices was found to decrease with increasing L . This is the case since the etch stop layer at the n =p -interface is not perfectly uniform.…”
Section: Resultsmentioning
confidence: 99%
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“…Prototype 30-nm MOSFETs have already been developed [2], [3] for the 65-nm technology node expected in 2005 [4]. Trapping of a single carrier charge in defect states near the Si/SiO interface and the related local modulation in carrier density and/or mobility [5]- [7] in an area comparable with the characteristic device dimensions, will have a profound effect on the drain and gate current [8] in such MOSFETs.…”
mentioning
confidence: 99%
“…Prototype MOSFETs with conventional architecture, gate length of 30 nm, and oxide thickness below 10 have already been successfully demonstrated [3]. In such devices, not only the discrete and random dopant charge [4]- [6], but also the atomic scale roughness of the Si/SiO and gate/SiO interfaces will introduce significant intrinsic parameter fluctuations.…”
Section: Introductionmentioning
confidence: 99%