Abstract:Damascene processing of copper interconnects for integrated circuits requires void-free filling of high aspect ratio trenches and vias. A combination of organic additives is commonly used to achieve bottom-up or superfilling of these features by electrochemical plating. To better understand the surface interactions of brightening agents, 3-mercapto-1-propanesulfonate (MPS) was studied by in situ shell-isolated nanoparticle-enhanced Raman spectroscopy (SHINERS). The influence of each functional group was dis… Show more
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