2018
DOI: 10.1109/tcpmt.2017.2781723
|View full text |Cite
|
Sign up to set email alerts
|

3-D Printed Structures by Microdispensing Materials Loaded With Dielectric and Magnetic Powders

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2018
2018
2024
2024

Publication Types

Select...
4
1

Relationship

0
5

Authors

Journals

citations
Cited by 6 publications
(1 citation statement)
references
References 23 publications
0
1
0
Order By: Relevance
“…Additive manufacturing (AM), commonly known as 3D printing, holds the potential to revolutionise electronics manufacturing by being able to combine printing of dissimilar materials in a single process and also realising complicated electronic devices that would normally require significant effort, manufacturing time and cost to integrate [26][27][28]. However, additively manufactured components do not always achieve bulk material properties due to process-specific limitations [29].…”
Section: Introductionmentioning
confidence: 99%
“…Additive manufacturing (AM), commonly known as 3D printing, holds the potential to revolutionise electronics manufacturing by being able to combine printing of dissimilar materials in a single process and also realising complicated electronic devices that would normally require significant effort, manufacturing time and cost to integrate [26][27][28]. However, additively manufactured components do not always achieve bulk material properties due to process-specific limitations [29].…”
Section: Introductionmentioning
confidence: 99%