3-D MCM Technology for Miniaturisation of an Electronic System

Abstract

Miniaturisation of a bulky system requires effective use and integration of modern packaging technology to achieve smaller size and lighter weight while consuming low power and achieving high speed. Using three-dimensional packaging technology, a system can be miniaturised to a small package popularly known as system-in-a-package (SIP). Various layers of component integration (die or packaged) in the horizontal and vertical directions lead to a compact system in a single package. In this paper, the development of an analog multi-chip module (MCM) is illustrated using 3-D technology. The major goals achieved using this technology are the mixedsignal integration, arealsize reduction, and low power. A comparison is made with the systemon-a-chip (SOC) technology and their merits and demerits are also discussed.