3‐D glass integrated stacked patch antenna array for silicon active package system
Lei Yang,
Kan Wang,
Binbin Wang
et al.
Abstract:Silicon‐based packaging is highly suitable for miniaturised and cost‐effective integrated systems. However, traditional silicon‐based antenna‐in‐package (AiP) has disadvantages, such as high loss, low efficiency and narrow bandwidth. A glass‐silicon active package system architecture is proposed. Its active part is integrated on a silicon substrate, while the antenna array in the package system is made of glass, which has high radiation efficiency. The proposed antenna structure is an H‐type aperture‐coupled m… Show more
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