2D Boron Nitride Nanosheets for Smart Thermal Management and Advanced Dielectrics

Abstract

With the rapid development of electronic devices toward the miniaturization, integration, and multi‐functionalization, the device stability, reliability, and service life face significant challenges due to the greatly increased heat accumulation. Therefore, it is highly desired to develop efficient thermal dissipation materials in thermal management. Thermally conductive polymer composites are expected to be widely applied in 5G communication, electronic packaging, and energy storage, owing to the ease of processing, good flexibility, low cost, etc. Boron nitride nanosheet (BNNS) is generally used as highly thermal conductive nanofillers for greatly improving the thermal conductivity of polymer. Mass production of high quality BNNS with desired properties and the structural design principles and fabrication methods for polymer/BNNS nanocomposites are critical to achieve extensive applications. Here, this review summarizes the latest advancement of the preparation method of BNNS and its polymer nanocomposites, as well as the innovatively structural design for observably improving the thermal management capability and energy storage performance of polymer/BNNS nanocomposites, expecting to offer some guidance on how to massively fabricate the BNNS and highly thermally conductive polymer composites.

Amino Acid-Assisted Sand-Milling Exfoliation of Boron Nitride Nanosheets for High Thermally Conductive Thermoplastic Polyurethane Composites

“…With remarkable physical and chemical properties, BNNSs are often used as fillers to prepare thermally conductive composites in the polymer matrix, which has application potential in the field of thermal management materials [ 15 , 16 , 17 ]. The team of Mikhael Bechelany and Philippe Miele has developed a green, simple, and effective method for the exfoliation of BNNSs using water as a solvent and biomass gelatin as an exfoliation agent.…”

Printed Electronics Based on 2D Material Inks: Preparation, Properties, and Applications toward Memristors

“…[70] In addition, the high thermal conductivity and electrical insulation of BN nanosheets show great potential for heat dissipation chips and high-temperature energy storage capacitors. [71] When fabricated into 2D h-BN inks, printed electronics required for high thermal conductivity and good electrical insulation can be fully met.…”

Development and Perspectives of Thermal Conductive Polymer Composites

“…Fillers commonly used in thermal conductive polymer composites include three types: metal fillers (silver, copper, aluminum), carbon-based fillers (carbon nanotubes, carbon fibers, graphene), and ceramic fillers (aluminum oxide, aluminum nitride, boron nitride) [ 2 , 17 , 25 , 26 , 71 , 72 , 73 , 74 , 75 , 76 , 77 ]. The values of thermal conductivity of various fillers at room temperature are shown in Table 2 [ 50 , 78 , 79 , 80 , 81 , 82 , 83 , 84 , 85 , 86 , 87 , 88 , 89 , 90 , 91 , 92 ].…”

“…With the advent of the 5G era, electronic devices and electronic equipment are developing toward miniaturization, integration, and high energy density [ 1 , 2 ]. However, a large amount of heat will be generated when various devices operate at high-power density, and the continuous accumulation of this heat will cause the device temperature to rise, thus affecting and reducing the function and service life of the devices [ 3 , 4 ].…”