2017 IEEE International Solid-State Circuits Conference (ISSCC) 2017
DOI: 10.1109/isscc.2017.7870459
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27.6 Single-chip 3072ch 2D array IC with RX analog and all-digital TX beamformer for 3D ultrasound imaging

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Cited by 17 publications
(13 citation statements)
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“…1(a)). By pre-processing the element-level echo signals, an ASIC allows the probe to use far fewer cable connections to the imaging system, thus enabling emerging miniature 3-D ultrasound probes which utilize high-density 2-D transducers (> 1000 elements) and small-size catheters [1], [5], [6].…”
Section: Introductionmentioning
confidence: 99%
“…1(a)). By pre-processing the element-level echo signals, an ASIC allows the probe to use far fewer cable connections to the imaging system, thus enabling emerging miniature 3-D ultrasound probes which utilize high-density 2-D transducers (> 1000 elements) and small-size catheters [1], [5], [6].…”
Section: Introductionmentioning
confidence: 99%
“…Various approaches have been reported to interface matrix transducer arrays using a reduced number of cables. [12], [17]- [19]. Part of the receive beamforming can be performed locally in the probe to combine the signals received by a sub-array into one output signal [12]- [14].…”
Section: Introductionmentioning
confidence: 99%
“…[12], [17]- [19]. Part of the receive beamforming can be performed locally in the probe to combine the signals received by a sub-array into one output signal [12]- [14]. Switch matrices have been proposed that connect groups of elements that transmit and receive simultaneously [15], [16].…”
Section: Introductionmentioning
confidence: 99%
“…In-probe application-specific integrated circuits (ASICs) have been used to locally drive the transducer elements and pre-process the received signals. These ASICs employ multiplexing switches, pulsers or sub-array beamforming circuits to allow the probe to be connected to an imaging system using a manageable number of cables [1] [2] [3] [4] [5]. These ASICs are subject to stringent size constraints, to provide direct connections between the elements and the associated on-chip circuitry, and stringent power constraints, to avoid overheating the patient's tissue.…”
Section: Introductionmentioning
confidence: 99%