250 °C isothermal section of ternary Sn-In-Cu phase equilibria

Abstract

Ternary Sn-In-Cu alloys are prepared and equilibrated at 250 °C for 2 to 20 weeks. The phases formed in these alloys are experimentally determined. The 250 °C Sn-In-Cu isothermal section is established according to the phase equilibrium information obtained in this study and that of the three constituent binary systems. It has eight single-phase regions, namely liquid, δ1-Cu41Sn11, ε-Cu3Sn, δ2-Cu7In3, η-(Cu6Sn5, Cu2In), Cu11In9, Cu2In3Sn, and α-(Cu) phases, 14 two-phase regions, and seven three-phase regions. In the Sn-In-Cu system at 250 °C, the η-Cu6Sn5 and η-Cu2In phases form a continuous solid solution and the ternary Cu2In3Sn compound is observed. The δ1-Cu41Sn11 phase is stabilized at 250 °C with the introduction of indium although it transforms into α-(Cu) and ε-Cu3Sn phases via a eutectoid reaction around 350 °C in the binary Sn-Cu system. Except for the Cu11In9 phase and the Cu2In3Sn ternary compound, the other binary compounds all have significant indium and tin mutual solubilities.

A Novel Electronic Packaging Method to Replace High-Temperature Sn-Pb Solders

“…This method is accepted by most people in the soldering society and the results remain convincing. 3,5,7,11,12 The data reveal that a considerable amount of In and Ni atoms are incorporated into the Sn and Cu sublattices of the Cu 6 Sn 5 phase. The micro-island shaped and the light region dispersed among the (Cu,Ni) 6 (Sn,In) 5 phase with a unique Cu-1.0 at.% Ni-14.6 at.% Sn-52.8 at.% In composition is likely the Cu 2 In 3 Sn phase.…”

“…The micro-island shaped and the light region dispersed among the (Cu,Ni) 6 (Sn,In) 5 phase with a unique Cu-1.0 at.% Ni-14.6 at.% Sn-52.8 at.% In composition is likely the Cu 2 In 3 Sn phase. [12][13][14] According to Lin's report, the Cu 2 In 3 Sn phase was stabilized at 250°C. 12 The composition of the layer structure region close to the Ni side is Ni-11.3 at.% Cu-29.5 at.% Sn-26.8 at.% In.…”

“…[12][13][14] According to Lin's report, the Cu 2 In 3 Sn phase was stabilized at 250°C. 12 The composition of the layer structure region close to the Ni side is Ni-11.3 at.% Cu-29.5 at.% Sn-26.8 at.% In. Koo et al reported that the layer-shaped Ni 3 (Sn,In) 4 phase with the Sn-38.4 at.%Ni-19.1 at.%In composition was formed in the In-48Sn/Au/Ni/Cu couple.…”

Thermodynamic Description of the Quaternary Ag-Cu-In-Sn System

“…Thermodynamic properties of the liquid phase were determined by Fitzner, 111 Jendrzejczyk-Handzlik et al, 112 Popovic and Bencze, 113 who determined the activity of elements in the liquid phase, and Li et al, 114 who measured the mixing enthalpy of the liquid phase. The phase equilibria of the ternary Cu-In-Sn system ware determined by Liu et al 115 and Lin et al 116 The quaternary system Ag-Cu-In-Sn was examined only in a tin-rich corner by Sopousek et al 117 as a potential solder material.…”

Wafer Level Solid Liquid Interdiffusion Bonding: Formation and Evolution of Microstructures

“…Moreover, the formation and evolution of microstructures is examined by utilizing thermodynamic calculations. [45][46][47] The stabilizing effect (i.e. the higher (more negative) value for Gibbs energy of formation) of In on Cu-Sn IMCs of Cu 6 Sn 5 and Cu 3 Sn is analysed and the effects on chemical potentials and driving forces diffusion are discussed.…”