225 Gb/s Bi-Directional Integrated Optical PCB Link

Schow,; Doany,; Lee, Myeong Soo; Budd,; Baks,; Dangel,; John, John; Libsch,; Kash,; Chan, Catherine S.; Lin, Pei-Chun; Carver,; Huang, Biao; Berry,; Bajkowski,

doi:10.1364/ofc.2011.pdpa2

Cited by 6 publications

(1 citation statement)

References 2 publications

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“…To scale speed despite these limitations, VCSELs are typically fabricated in large 2D arrays as for example in typical parallel optics arrangements with up to 12 channels at 12.5 Gb/s per channel, however requiring a bulky 24-line optical fiber array and the respective driver electronics. System integration of VCSELs involves different options like mounting in simple SNAP12 packages [9] or bonding to PCBs [10].…”

Section: Introductionmentioning

confidence: 99%

Photonic integration enabling new multiplexing concepts in optical board-to-board and rack-to-rack interconnects

Apostolopoulos

Bakopoulos

Kalavrouziotis

et al. 2014

Optical Interconnects XIV

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New broadband applications are causing the datacenters to proliferate, raising the bar for higher interconnection speeds. So far, optical board-to-board and rack-to-rack interconnects relied primarily on low-cost commodity optical components assembled in a single package. Although this concept proved successful in the first generations of opticalinterconnect modules, scalability is a daunting issue as signaling rates extend beyond 25 Gb/s. In this paper we present our work towards the development of two technology platforms for migration beyond Infiniband enhanced data rate (EDR), introducing new concepts in board-to-board and rack-to-rack interconnects.The first platform is developed in the framework of MIRAGE European project and relies on proven VCSEL technology, exploiting the inherent cost, yield, reliability and power consumption advantages of VCSELs. Wavelength multiplexing, PAM-4 modulation and multi-core fiber (MCF) multiplexing are introduced by combining VCSELs with integrated Si and glass photonics as well as BiCMOS electronics. An in-plane MCF-to-SOI interface is demonstrated, allowing coupling from the MCF cores to 340x400 nm Si waveguides. Development of a low-power VCSEL driver with integrated feed-forward equalizer is reported, allowing PAM-4 modulation of a bandwidth-limited VCSEL beyond 25 Gbaud.The second platform, developed within the frames of the European project PHOXTROT, considers the use of modulation formats of increased complexity in the context of optical interconnects. Powered by the evolution of DSP technology and towards an integration path between inter and intra datacenter traffic, this platform investigates optical interconnection system concepts capable to support 16QAM 40GBd data traffic, exploiting the advancements of silicon and polymer technologies.

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Section: Introductionmentioning

confidence: 99%

Photonic integration enabling new multiplexing concepts in optical board-to-board and rack-to-rack interconnects

Apostolopoulos

Bakopoulos

Kalavrouziotis

et al. 2014

Optical Interconnects XIV

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Efficient Heat Dissipation of Uncooled 400-Gbps (16×25-Gbps) Optical Transceiver Employing Multimode VCSEL and PD Arrays

Shih

Chieh

Wang

et al. 2017

Sci Rep

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An effective heat dissipation of uncooled 400-Gbps (16×25-Gbps) form-factor pluggable (CDFP) optical transceiver module employing chip-on-board multimode 25-Gbps vertical-surface-emitting-laser (VCSEL) and 25-Gbps photodiode (PD) arrays mounted on a brass metal core embedded within a printed circuit board (PCB) is proposed and demonstrated. This new scheme of the hollow PCB filling with thermally-dissipated brass metal core was simulated and used for high temperature and long term stability operation of the proposed 400-Gbps CDFP transceiver. During one-hour testing, a red-shift of central wavelength by 0.4-nm corresponding temperature increment of 6.7 °C was observed with the brass core assisted cooler module. Such a temperature change was significantly lower than that of 28.3 °C for the optical transceiver driven with conventional circuit board. After 100-m distance transmission over a multimode fiber (OM4), the 400-Gbps CDFP transceiver exhibited dispersion penalty of 2.6-dB, power budget of ≧ 3-dB, link loss of ≦ 0.63-dB, mask margin of 20%, and bit error rate (BER) of <10−12 with maintained stability more than one hour. The developed 400-Gbps CDFP transceiver module employing low-power consumption VCSEL and PD arrays, effective coupling lens arrays, and well thermal-dissipation brass metal core is suitable for use in the low-cost and high-performance data center applications.

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Digitally-assisted analog circuits for a 10 Gbps, 395 fJ/b optical receiver in 40 nm CMOS

Amberg

Liu

Dayringer

et al. 2011

IEEE Asian Solid-State Circuits Conference 2011

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225 Gb/s Bi-Directional Integrated Optical PCB Link

Cited by 6 publications

References 2 publications

Photonic integration enabling new multiplexing concepts in optical board-to-board and rack-to-rack interconnects

Photonic integration enabling new multiplexing concepts in optical board-to-board and rack-to-rack interconnects

Efficient Heat Dissipation of Uncooled 400-Gbps (16×25-Gbps) Optical Transceiver Employing Multimode VCSEL and PD Arrays

Digitally-assisted analog circuits for a 10 Gbps, 395 fJ/b optical receiver in 40 nm CMOS

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