20Gbps/ch optical interconnection between SERDES devices over distances from chip-to-chip to rack-to-rack

Sakai, Jun; Noda, Akiko; Yamagishi, M.; Ohtsuka, Takashi; Sunaga, Kazuhisa; Sugita, Hideyuki; Takahashi, H.; Oda, Mikio; Ono, Hiroshi; Yashiki, Kenichiro; Kouta, Hikaru

doi:10.1109/ecoc.2008.4729317

Cited by 11 publications

(4 citation statements)

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“…Many people believe that replacing electrical cables with optical fibres will solve many of the problems associated with the transmission of signals with GHz frequencies. This is reflected in the number of articles [1][2][3][4] and books concerning the introduction of optical interconnects into VLSI circuits [5][6][7][8]. The optical connections found in Integrated Systems (IS) divide into two groups: on-chip and off-chip.…”

Section: Introductionmentioning

confidence: 99%

The integration of optical interconnections on ceramic substrates

Guzowski

Rosowski

Lisik

et al. 2016

Microelectronic Engineering

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Section: Introductionmentioning

confidence: 99%

The integration of optical interconnections on ceramic substrates

Guzowski

Rosowski

Lisik

et al. 2016

Microelectronic Engineering

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“…The current copper based electrical interconnects face serious challenges to meet such demands [2,3]. Optical communication systems are emerging as alternative approaches at several levels including chip-to-chip [4][5][6], intra-board [7,8], board-to-board [9][10][11][12], card-to-backplane [13,14] and rack-to-rack interconnects [15,16]. Optical interconnects consisting of arrays of Vertical Cavity Surface-Emitting Lasers (VCSELs) and Photo-detectors (PDs) have been shown to be superior to copper based electrical interconnects in terms of cost, power, and bandwidth [17,18].…”

Section: Introductionmentioning

confidence: 99%

Low-cost board-to-board optical interconnects using molded polymer waveguide with 45 degree mirrors and inkjet-printed micro-lenses as proximity vertical coupler

Lin¹,

Hosseini²,

Dou³

et al. 2013

Opt. Express

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We demonstrate intra- and inter-board level optical interconnects using polymer waveguides and waveguide couplers consisting of both 45 degree total internal reflection (TIR) mirrors and inkjet-printed micro-lenses. Surface normal couplers consisting of 50 µm × 50 µm waveguides with embedded 45 degree mirrors are fabricated using a nickel mold imprint. Micro-lenses, 70 µm in diameter, are inkjet-printed on top of the mirrors. We characterize the optical transmission between waveguides located on different boards in terms of insertion loss, mirror coupling loss, and free space propagation loss as a function of interconnection distance in free space. Each mirror contributes 1.88 dB loss to the system, corresponding to 65% efficiency. The printed micro-lenses improve the transmission by 2-4 dB (per coupler). Data transmission at 10 Gbps reveals that inter-board interconnects has a bit error rate (BER) of 1.1 × 10(-10) and 6.2 × 10(-13) without and with the micro-lenses, respectively.

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“…This is reflected in a number of articles [1][2][3][4][5] and books related to the introduction of optical interconnectors for very-large-scale integration (VLSI) circuits [6][7][8][9]. A printed circuit board (PCB) makes use of optical systems communicating with each other in free space [10].…”

Section: Optical Connections In Chip-to-chip Systemsmentioning

confidence: 99%