204-GBaud On-Off Keying Transmitter for Inter-Data Center Communications

Mardoyan, H.; Jorge, F.; Ozoliņš, Oskars; Estaran, Jose; Udaļcovs, Aleksejs; Konczykowska, A.; Riet, M.; Duval, B.; Nodjiadjim, Virginie; Dupuy, Jean-Yves; Pang, Xiaodan; Westergren, Urban; Chen, Jiajia; Popov, Sergei; Bigo, S.

doi:10.1364/ofc.2018.th4a.4

Cited by 38 publications

(20 citation statements)

References 6 publications

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“…Secondly, higher integration between the electronics and the optics with joint optimization could offer better signal integrity. As a step forward, a demonstration of up to 200 GBd OOK transmission was successfully achieved with the HECTO components [15,16], by improving on the modulated signal quality. We review and discussed the key enabling technologies to realize single lane IM/DD transmission data rate of 200 Gbps and beyond.…”

Section: Discussionmentioning

confidence: 99%

Beyond 200 Gbps per Lane Intensity Modulation Direct Detection (IM/DD) Transmissions for Optical Interconnects: Challenges and Recent Developments

Pang

Ozoliņš

Udaļcovs

et al. 2019

Optical Fiber Communication Conference (OFC) 2019

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Section: Discussionmentioning

confidence: 99%

Beyond 200 Gbps per Lane Intensity Modulation Direct Detection (IM/DD) Transmissions for Optical Interconnects: Challenges and Recent Developments

Pang

Ozoliņš

Udaļcovs

et al. 2019

Optical Fiber Communication Conference (OFC) 2019

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“…Despite the challenges, an increase of the symbol rate would be a favored solution for DCI and has been subject of much recent research. A 204 Gb/s On-Off keying (OOK) transmitter has been demonstrated using InP platforms for both the optics and electronics in combination with offline DSP [5,6]. Similarly, an EAM integrated with a DFB laser (EADFB) was used to demonstrate 214 Gb/s PAM-4 transmission [7].…”

Section: :1 Silicon Photonic Serializer For Data Centermentioning

confidence: 99%

4:1 Silicon Photonic Serializer for Data Center Interconnects Demonstrating 104 Gbaud OOK and PAM4 Transmission

Verbist

Vanhoecke

Lillieholm

et al. 2019

J. Lightwave Technol.

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“…OMMUNICATION demands have been pushing the progress of photonic integrated circuit (PIC) technology requiring higher speed and lower energy for system-on-chip designs [1]. The solution for telecommunication's ever increasing demand for capacity can be found in 1) higher bandwidth per channel [2], 2) higher number of channels [3], and 3) using increasingly complex modulation formats [4] [5]. Wavelength division multiplexing (WDM) is a common technique of combining many channels on a single chip.…”

Section: Introductionmentioning

confidence: 99%

Increasing the Speed of an InP-Based Integration Platform by Introducing High Speed Electroabsorption Modulators

Trajkovic

Blache

Debrégeas³

et al. 2019

IEEE J. Select. Topics Quantum Electron.

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204-GBaud On-Off Keying Transmitter for Inter-Data Center Communications

Cited by 38 publications

References 6 publications

Beyond 200 Gbps per Lane Intensity Modulation Direct Detection (IM/DD) Transmissions for Optical Interconnects: Challenges and Recent Developments

Beyond 200 Gbps per Lane Intensity Modulation Direct Detection (IM/DD) Transmissions for Optical Interconnects: Challenges and Recent Developments

4:1 Silicon Photonic Serializer for Data Center Interconnects Demonstrating 104 Gbaud OOK and PAM4 Transmission

Increasing the Speed of an InP-Based Integration Platform by Introducing High Speed Electroabsorption Modulators

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