2-D simulation of dual frequency capacitively coupled helium plasma, using COMSOL multiphysics

Rebiai, S.; Bahouh, Hanene; Sahli, S.

doi:10.1109/tdei.2013.6633691

Cited by 31 publications

(18 citation statements)

References 36 publications

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“…An adaptive mesh was therefore applied to resolve the problems of this simulation. A fixed mesh is typically used in plasma simulations [9] because it can be easily applied for calculations. Although this approach is advantageous, the probability of an error increases when the variable range in the mesh is large.…”

Section: Adaptive Mesh Methods Applied To Poisson Solver Module For 3dmentioning

confidence: 99%

Adaptive Mesh Method Applied to Poisson Solver Module for 3D Capacitively Coupled Plasma Discharge Simulation

Lee

Shon

Kim

et al. 2020

Appl. Sci. Converg. Technol.

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In plasma discharge simulation, the configuration of a mesh has a significant influence on convergence. However, it is time consuming to obtain a suitable mesh. We thus propose a module approach that automatically adjusts a mesh at a specific location as the calculation proceeds. It was confirmed that the mesh is adjusted in a direction that reduces the probability of an error. The adaptive mesh refinement and coarsening method was applied to the Poisson equation module of a three-dimensional capacitively coupled plasma equipment model for semiconductors. By comparing the respective results of the adaptive mesh and fixed mesh models, we confirmed that the error of the electric potential value decreases.

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Section: Adaptive Mesh Methods Applied To Poisson Solver Module For 3dmentioning

confidence: 99%

Adaptive Mesh Method Applied to Poisson Solver Module for 3D Capacitively Coupled Plasma Discharge Simulation

Lee

Shon

Kim

et al. 2020

Appl. Sci. Converg. Technol.

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show abstract

“…In the simulation, the electron energy distribution function (EEDF) is approximately set as the Maxwellian distribution function, due to the fact that the discharge pressure 80 Pa is greater than 6.66 Pa [21,22]. Although publications show that the plasma densities in simulations as Maxwellian distribution are higher than experimental measurements, they also show that the plasma distributions in simulations present good agreement with experimental measurements [23][24][25][26].…”

Section: Experiments Designmentioning

confidence: 99%

Dual-Frequency Microwave Plasma Source Based on Microwave Coaxial Transmission Line

Chen

Zhang

et al. 2021

Applied Sciences

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A dual-frequency plasma source has many advantages in applications. In this paper, a dual-frequency microwave plasma source is presented. This microwave plasma source is based on a coaxial transmission line without the resonator, and it can be operated in a wide band frequency region. Two microwaves are inputted from two ports into the plasma reactor: one is used firstly to excite the plasma and the other one is used to adjust plasma characteristics. Based on the COMSOL Multiphysics simulation, the experiment is carried out. In the experimental investigation, the plasma electron density and electron temperature can be controlled, respectively, by feeding in different frequencies from the second port, causing the particles at different energy levels to present different frequencies. This exploratory research improves the operation frequency of dual-frequency microwave plasma sources from RF to microwave.

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“…The repetition of this process allows the number of electrons and positive ions to grow. The creation of secondary electrons is influenced by the variation of operational parameters, such as frequency and potential, [15][16][17] the type of gas, [4,5,18] and especially the influence of pressure and reactor geometry. [3,14,19]…”

Section: Plasma Dischargementioning

confidence: 99%

Effect of pressure and space between electrodes on the deposition of SiN_xH_y films in a capacitively coupled plasma reactor

et al. 2021

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The fluid model, also called the macroscopic model, is commonly used to simulate low temperature and low pressure radiofrequency plasma discharges. By varying the parameters of the model, numerical simulation allows us to study several cases, providing us the physico-chemical information that is often difficult to obtain experimentally. In this work, using the fluid model, we employ numerical simulation to show the effect of pressure and space between the reactor electrodes on the fundamental properties of silicon plasma diluted with ammonia and hydrogen. The results show the evolution of the fundamental characteristics of the plasma discharge as a function of the variation of the pressure and the distance between the electrodes. By examining the pressure-distance product in a range between 0.3 Torr 2.7 cm and 0.7 Torr 4 cm, we have determined the optimal pressure-distance product that allows better deposition of hydrogenated silicon nitride (SiN x H y ) films which is 0.7 Torr 2.7 cm.

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2-D simulation of dual frequency capacitively coupled helium plasma, using COMSOL multiphysics

Cited by 31 publications

References 36 publications

Adaptive Mesh Method Applied to Poisson Solver Module for 3D Capacitively Coupled Plasma Discharge Simulation

Adaptive Mesh Method Applied to Poisson Solver Module for 3D Capacitively Coupled Plasma Discharge Simulation

Dual-Frequency Microwave Plasma Source Based on Microwave Coaxial Transmission Line

Effect of pressure and space between electrodes on the deposition of SiN_xH_y films in a capacitively coupled plasma reactor

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2-D simulation of dual frequency capacitively coupled helium plasma, using COMSOL multiphysics

Cited by 31 publications

References 36 publications

Adaptive Mesh Method Applied to Poisson Solver Module for 3D Capacitively Coupled Plasma Discharge Simulation

Adaptive Mesh Method Applied to Poisson Solver Module for 3D Capacitively Coupled Plasma Discharge Simulation

Dual-Frequency Microwave Plasma Source Based on Microwave Coaxial Transmission Line

Effect of pressure and space between electrodes on the deposition of SiN x H y films in a capacitively coupled plasma reactor

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Product

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Effect of pressure and space between electrodes on the deposition of SiN_xH_y films in a capacitively coupled plasma reactor