2012
DOI: 10.1109/tthz.2012.2191150
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2.5D Micromachined 240 GHz Cavity-Backed Coplanar Waveguide to Rectangular Waveguide Transition

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Cited by 23 publications
(5 citation statements)
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“…1. Micromachined waveguide surface roughness: (a) E-plane split, waveguide halves DRIE along the waveguide width and subsequently joined together [6], [7]; (b) single H-plane split DRIE along the waveguide height [8], [6], [9]; and (c) double H-plane split DRIE along the waveguide height, as proposed in this paper.…”
Section: Drie Drie Driementioning
confidence: 99%
“…1. Micromachined waveguide surface roughness: (a) E-plane split, waveguide halves DRIE along the waveguide width and subsequently joined together [6], [7]; (b) single H-plane split DRIE along the waveguide height [8], [6], [9]; and (c) double H-plane split DRIE along the waveguide height, as proposed in this paper.…”
Section: Drie Drie Driementioning
confidence: 99%
“…Transitions from planar transmission lines to rectangular waveguides enable integration of active components in such systems [11]. Conductor-backed (CB) CPW to rectangular waveguide transitions at 220-330 GHz have been presented in [12], [13], while [14] introduces a CB-CPW transition to rectangular waveguides for MMIC packaging at 340-380 GHz. The authors have previously reported on a codesigned transition from a microstrip line on a InP MMIC to silicon micromachined waveguides at 220-330 GHz [15].…”
Section: Introductionmentioning
confidence: 99%
“…These structures are relatively easy to manufacture and can be used for very high frequency. Vahidpour and Sarabandi (2012) presented cavity-backed coplanar waveguide to rectangular waveguide transition demonstrating viability and fabrication process of their prototype at 240 GHz. Tang et al (2016) shown dielectric based waveguide for high speed communication with Teflon cladding operating up to 100 GHz.…”
Section: Introductionmentioning
confidence: 99%