2014
DOI: 10.1002/smll.201402295
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1D Copper Nanostructures: Progress, Challenges and Opportunities

Abstract: One-dimensional noble metal nanostructures are important components in modern nanoscience and nanotechnology due to their unique optical, electrical, mechanical, and thermal properties. However, their cost and scalability may become a major bottleneck for real-world applications. Copper, being an earth-abundant metallic element, is an ideal candidate for commercial applications. It is critical to develop technologies to produce 1D copper nanostructures with high monodispersity, stability and oxygen-resistance … Show more

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Cited by 190 publications
(147 citation statements)
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References 199 publications
(276 reference statements)
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“…However, the material cost and migration caused in moist conditions are considered detrimental to their use in TCF and researches on alternative metallic NWs are being considered. Consequently, the research on the development of Cu NWs are on the rise due to the availability of cheap and abundant resources, high electrical properties, and low migration problem despite the fact that Cu has showed low stability in moist and oxidizing atmospheres [4][5][6][7][8]. Consequently, several physical and chemical routes have been developed to synthesize Cu NWs; however, in most cases, the chemical routes are considered due to simplicity and scalability of these techniques in contrast to other routes [9][10][11][12][13][14][15][16][17][18][19][20][21][22].…”
Section: Introductionmentioning
confidence: 99%
“…However, the material cost and migration caused in moist conditions are considered detrimental to their use in TCF and researches on alternative metallic NWs are being considered. Consequently, the research on the development of Cu NWs are on the rise due to the availability of cheap and abundant resources, high electrical properties, and low migration problem despite the fact that Cu has showed low stability in moist and oxidizing atmospheres [4][5][6][7][8]. Consequently, several physical and chemical routes have been developed to synthesize Cu NWs; however, in most cases, the chemical routes are considered due to simplicity and scalability of these techniques in contrast to other routes [9][10][11][12][13][14][15][16][17][18][19][20][21][22].…”
Section: Introductionmentioning
confidence: 99%
“…Motivated by the intrinsic advantages of copper, CuNWs have drawn much attention for application in flexible electronics. 12 However, CuNWs are very sensitive to oxygen that greatly hinders their developments. Althrough coating a thin layer of materials (Ni, [13][14][15][16] Pt, 17,18 Au, 13,19 Zn, 20 Sn, 20 Ag, 21,22 AZO, 23 carbon materials, 24-27 et al) on CuNWs is an effective way to prevent the oxidation of CuNWs, these methods are usually electrodeposition methods, chemical or physical vapor deposition (CVD or PVD), one pot or two pot method at high temperature (210 °C), et al It is highly dependent on the costly equipments and rigorous reaction conditions, which are not advantageous in wide applications in industry (see the summary of core-shell NWs based on CuNWs in Table S2).…”
Section: Introductionmentioning
confidence: 99%
“…There have been several previous reviews that cover either PSCs or MeNW electrodes. [15,16,31,[33][34][35][36][37][38][39][40][41][42] For this reason, a brief overview of PSCs and MeNWs is given in this section.…”
Section: Overview For Pscs and Menw-network Electrodesmentioning
confidence: 99%