2023 IEEE International Solid- State Circuits Conference (ISSCC) 2023
DOI: 10.1109/isscc42615.2023.10067459
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17.3 A 14b 16GS/s Time-Interleaving Oirect-RF Synthesis OAe with T-OEM Achieving -70dBc IM3 up to 7.8GHz in 7nm

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Cited by 2 publications
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“…However, a large ε O1 will slightly increase the noise floor in the DQS structure. On the other hand, the OSEs and SSEs are independent on the output impedance of the current source, indicating that the harmonic distortion (e.g., (13)) cannot be reduced by increasing output impedance. As depicted in Figure 6a, SFDR attenuation from ε f 1 is notably worse at low frequencies compared with ε O1 , yet ε O1 's attenuation intensifies more steeply as frequency rises.…”
Section: Boundary Effect Errors (Bees)mentioning
confidence: 99%
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“…However, a large ε O1 will slightly increase the noise floor in the DQS structure. On the other hand, the OSEs and SSEs are independent on the output impedance of the current source, indicating that the harmonic distortion (e.g., (13)) cannot be reduced by increasing output impedance. As depicted in Figure 6a, SFDR attenuation from ε f 1 is notably worse at low frequencies compared with ε O1 , yet ε O1 's attenuation intensifies more steeply as frequency rises.…”
Section: Boundary Effect Errors (Bees)mentioning
confidence: 99%
“…Nevertheless, studies have shown that DACs still suffer from harmonic distortion with the DEM scheme [12], as they are also affected by output-dependent modulation (ODM). Conventional DEM only deals with mismatches of an individual DAC; a new time-interleaving DEM (T-DEM) that randomizes the residual offset, gain, and skew mismatches is introduced in [13]. T-DEM tackles the mismatches between the two DACs, reducing the constraint of TI spur on the performance of high-speed TI DACs.…”
Section: Introductionmentioning
confidence: 99%