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Peralta-Martínez, M. V.; Wakeham, W. A.

doi:10.1023/a:1010714612865

Cited by 37 publications

(15 citation statements)

References 5 publications

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“…7. All of the previously measured data [12] fall into the ±5% uncertainty region of the current experiment, and the data are comfortably within ±3% at temperatures close to the melting point. The new method of analysis is felt to be superior, and thus the results reported here are thought to be more accurate than our earlier results because both the measuring technique and equipment have been improved.…”

Section: Resultssupporting

confidence: 74%

“…The measured thermal conductivity for molten indium (purity 99.99%) over a wide range of temperatures is shown in Table I, and the comparison with previous studies and other sources [9][10][11][12][13][14] is illustrated in Fig. 7.…”

Section: Resultsmentioning

confidence: 99%

“…8 shows the comparison with previous work using the same method [12] and with other sources (i.e., steady-state methods [15,16], another transient hot-wire instrument [17], or recommended and correlated values [11,18]). The new experimental results are found in very good agreement with Hemminger [15] and Mills et al [18].…”

Section: Resultsmentioning

confidence: 99%

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Repeatability and Refinement of a Transient Hot-Wire Instrument for Measuring the Thermal Conductivity of High-Temperature Melts

2006

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The paper reports an assessment of the repeatability of a method for the measurement of the thermal conductivity of high temperature melts. The main goal is to demonstrate that a novel approach to the transient hotwire technique can yield highly accurate results that are consistent with previous, independent measurements. The paper summarizes the modified transient hot-wire method, presents improvements in the finite-element analysis of its operation, and briefly discusses deviations from available analytical equations. The transient hot-wire instrument and experimental configuration are also described. Results from measurements on molten metals, in particular, tin and indium, in the temperature range from their melting points up to 750 K are presented. A comparison with previously measured values is given, and the accuracy and repeatability of the method are discussed.

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Section: Resultssupporting

confidence: 74%

Section: Resultsmentioning

confidence: 99%

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Repeatability and Refinement of a Transient Hot-Wire Instrument for Measuring the Thermal Conductivity of High-Temperature Melts

2006

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“…It has a cylindrical-type setup, meaning the cuvettes for both sample and reference are encompassed by a large number of thermocouples to detect changes in the temperature difference between a sample and reference cuvette (Auroux, 2013;Calvet and Prat, 1963). A calibration run then delivers a function between the measured temperature difference and the heat flow (Sarge et al, 1994). In our previous work, we have demonstrated the feasibility of a sensor for a TianCalvet calorimeter based on low temperature co-fired ceramics (LTCC) technology (Schubert et al, 2016).…”

Section: Introductionmentioning

confidence: 99%

Optimization of a sensor for a Tian–Calvet calorimeter with LTCC-based sensor discs

Schubert

Gollner²,

Kita

et al. 2016

J. Sens. Sens. Syst.

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Abstract. In this work, it is shown how a finite element method (FEM) model of a Tian-Calvet calorimeter is used to find improvements in the sensor design to increase the sensitivity of the calorimeter. By changing the layout of the basic part of the sensor, which is a low temperature co-fired ceramics (LTCC) based sensor disc, an improvement by a factor of 3 was achieved. The model was validated and the sensors were calibrated with a set of measurements that were later used to determine the melting enthalpies and melting temperatures of indium and tin samples. Melting temperatures showed a maximum deviation of 0.2 K while the enthalpy was measured with a precision better than 1 % for most samples. The values for tin deviate by less than 2 % from literature data.

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“…Size Effect Anisotropy (nCB [9]) Solid/Solid Transition (s/s) Solid/Liquid Transition (s/l) Superconductor (NbC 0.97 [22]) Active Thermal Conductivity Switch (TCS) Rectification (C 9 H 16 Pt coated CNT and BNNT [24], Asymmetric nano VO2 beam [25], Thermal diode [26]) Electric/ Magnetic/Stress (Bees-wax [6], SrTiO 3 [7], 5CB [8], Cu wire [10], InSb [11], Ferroric-twinned thin film [12]) MEMS (Thermal switch radiator [16], Solid-Liquid thermal interface [17,18]) Thermomechanical (Gas gap heat switch [19]) Thermal (Automatic heat switch [20], Thermal actuator [21]) Wetting (B nanoribbon [13,14], Film/transition boiling transition [15] [44], Te [32,45], InSb / GaSb [46], CdSb [47,48], AlSb [49][50][51], Zn 3 Sb 2 [52]) Semiconductor /Semiconductor (S/S) (LiNO 3 [35], InSe [41]) Metal /Metal (M/M) (Hg [32], K / Zn / Sb / Al / Cu [32,53], Sn [33,53], Ga [32,53,54], In [53,55,56], Cd …”

Section: Bulkmentioning

confidence: 99%

Thermal conductivity switch: Optimal semiconductor/metal melting transition

Kim

Kaviany

2016

Phys. Rev. B

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Scrutinizing distinct solid/liquid (s/l) and solid/solid (s/s) phase transitions (passive transitions) for large change in bulk (and homogenous) thermal conductivity, we find the s/l semiconductor/metal (S/M) transition produces largest dimensionless thermal conductivity switch (TCS) figure of merit Z TCS (change in thermal conductivity divided by smaller conductivity). At melting temperature, the solid phonon and liquid molecular thermal conductivities are comparable and generally small, so the TCS requires localized electron solid and delocalized electron liquid states.For cyclic phase reversibility, the congruent phase transition (no change in composition) is as important as the thermal transport. We identify XSb and XAs (X = Al, Cd, Ga, In, Zn) and describe atomic-structural metrics for large Z TCS , then show the superiority of S/M phonon-to electrondominated transport melting transition. We use existing experimental results and theoretical and ab initio calculations of the related properties for both phases (including the Kubo-Greenwood and Bridgman formulations of liquid conductivities). The 5p orbital of Sb contributes to the semiconductor behavior in the solid-phase bandgap and upon disorder and bond-length changes in the liquid phase this changes to metallic, creating the large contrast in thermal conductivity.The charge density distribution, electronic localization function, and electron density of states are used to mark this S/M transition. For optimal TCS, we examine the elemental selection from the transition-, basic-and semimetals and semiconductor groups. For CdSb, addition of residual Ag suppresses the bipolar conductivity and its Z TCS is over 7, and for Zn 3 Sb 2 it is expected to be over 14, based on the structure and transport properties of the better known β-Zn 4 Sb 3 . This is the highest Z TCS identified. In addition to the metallic melting, the high Z TCS is due to the electron-poor nature of II-V semiconductors leading to the significantly low phonon conductivity.

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Cited by 37 publications

References 5 publications

Repeatability and Refinement of a Transient Hot-Wire Instrument for Measuring the Thermal Conductivity of High-Temperature Melts

Repeatability and Refinement of a Transient Hot-Wire Instrument for Measuring the Thermal Conductivity of High-Temperature Melts

Optimization of a sensor for a Tian–Calvet calorimeter with LTCC-based sensor discs

Thermal conductivity switch: Optimal semiconductor/metal melting transition

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