135-GHz co-planar patch array on BCB/silicon with polymer-filled cavity

Yeap, Siew Bee; Chen, Zhi Ning; Ho, David; Guan, Lim Teck

doi:10.1109/iwat.2011.5752313

Cited by 2 publications

(4 citation statements)

References 7 publications

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“…As such, low loss dielectrics and polymers have been making its way into silicon technology recently [2]- [9]. These polymers can be coated on top of the silicon to act as a substrate for transmission lines as well as antennas, which reduces the substrate loss and the surface-wave loss in certain designs.…”

Section: Introductionmentioning

confidence: 99%

“…These polymers can be coated on top of the silicon to act as a substrate for transmission lines as well as antennas, which reduces the substrate loss and the surface-wave loss in certain designs. Benzocyclobutene (BCB) is the current frontrunner because of lower loss tangent as well as lower mechanical stress [5]- [9]. In addition, polymers can also be used as the material to fill cavities formed in the silicon substrate, which is useful to design cavity backed antennas [5].…”

Section: Introductionmentioning

confidence: 99%

“…In addition, polymers can also be used as the material to fill cavities formed in the silicon substrate, which is useful to design cavity backed antennas [5]. In this case, polymer such as DuPont PerMX is more suitable since BCB can crack when thick layers are formed [9]. This paper presents a 2×2 co-planar patch antenna array on BCB membrane with a low-loss polymer-filled cavity at 135 GHz.…”

Section: Introductionmentioning

confidence: 99%

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135GHz antenna array on BCB membrane backed by polymer-filled cavity

Yeap

Chen

Qing

et al. 2012

2012 6th European Conference on Antennas and Propagation (EUCAP)

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A 2×2 co-planar patch array on benzocyclobutene (BCB) membrane backed by low-loss polymer-filled cavities is designed and verified by measurement at 135GHz. The backing cavity is designed to enhance the antenna gain as well as to provide mechanical stability of the structure. The array is verified by measurement in a submillimeter-wave chamber with an achieved impedance bandwidth of up to 17 GHz (125 142 GHz) for |S 11 | 10 dB and gain of 10.4 dBi at 135 GHz. The antenna array on Si/BCB is compatible with through-silicon via (TSV) based technique for 3D packaging system. The design is low profile yet still provides much higher gain performance when compared to antennas fabricated directly onto silicon substrate.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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135GHz antenna array on BCB membrane backed by polymer-filled cavity

Yeap

Chen

Qing

et al. 2012

2012 6th European Conference on Antennas and Propagation (EUCAP)

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“…The two mentioned 60 GHz antennas have planar dimensions of 1.71 x 2.0 mm 2 and 2.5 x 2.5 mm 2 , respectively.Finally, a 135 GHz co-planar patch antenna has been microfabricated on silicon wafers with polymer-filled cavities as shown inFig. 6.9[82] which has a planar dimensions of 600 x 700 µm 2 . Per the earlier discussion, antennas designed for this operating frequency would enable wireless communications for the 1.5 mm 3 platform as one could fabricate the antenna structures on a single platform component face.…”

mentioning

confidence: 99%