13.56 MHz radio frequency plasma properties on hemispheric electrodes and diamond-like carbon films deposition on three-dimensional polyurethane diaphragms

Abstract

The characteristics of the radio frequency (rf) plasma that could hold an entire hemispheric polyurethane diaphragm generated using the hemispheric-type electrode were investigated. The plasma states were measured using Langmuir probe. Although the common rf plasma chemical vapor deposition technique using planar electrodes makes it difficult to apply uniform plasma to three-dimensional structures, the hemispheric-type electrode process could uniformly hold a hemispheric polyurethane diaphragm at self-bias voltage. As a result, this process could uniformly keep the ion sheath on the diaphragm. In case of using this process for diamond-like carbon (DLC) film deposition, the DLC film was deposited uniformly on the diaphragm at approximately 300nm. Besides electron temperatures and electron number of densities were similar to the behavior of common rf plasma. This means that the characteristics of plasma are kept in the same states even if the plasma form is controlled using such a hemispheric-type electrode. Based on these results, this hemispheric-type electrode process was observed to be quite applicable to three-dimensional insulator structures.

Microstructure and properties of Cr–Cu–N coatings with ultra-low copper content

“…3.5 at.% and 15 at.%, respectively) with bias in DC condition [13]. The change of Cu content in this experiment is due to the higher ionization of the RF magnetron sputtering than that of DC [15][16][17]. Fig.…”

“…For the DC coatings containing low Cu content (about 3.5%), the preferred orientation changes from CrN(111) to (200) with increasing bias due to bias effect [13]. The difference of the structure in RF and DC sputtering is a higher ionization for RF condition which results in more effective ion impinging on the coating growth and then affecting the growth orientation [15][16][17][18][19][20]. Therefore, Cu content, bias and RF/DC are all responsible for preferred orientation.…”

Diamond-like Carbon Film Deposition on an Artificial Heart Blood Pump Using a Flexible Type Electrode with r.f. Plasma CVD Processing

“…plasma chemical vapor deposition (CVD) technique is very useful for DLC films deposition on most substrates that are conductor and/or insulator substrates at low temperatures [6,7]. plasma, respectively [9][10][11][12]. A large number of reports have suggested biomedical applications of a-C:H films including DLC films [8].…”