125-µm-pitch × 12-channel “optical pin” array as I/O structure for novel miniaturized optical transceiver chips

25-Gb/s Operation of a Polymer Optical Waveguide on an Electrical Hybrid LSI Package Substrate With Optical Card Edge Connector

“…We propose a multimode optical link using a Si photonic transmitter, receiver, polymer-based PCB, and MMF at 1.3 m. In addition, we have reported the development of a chip-scale parallel multimode optical module using Si photonics in previous papers [10,11,13]. However, a polymer-based optical and electrical LSI package substrate with optical card edge connectors for multimode Si photonics in the 1.3-m band has not yet been realized.…”

“…The launch condition produces a filled or overfilled launch into the polymer waveguide. We can thus realize high-efficiency coupling of our proposed multimode silicon photonic receiver with a numerical aperture greater than 0.2 [13]. In addition, we measured the coupling loss of several mirrors.…”

Fingertip-Size Optical Module, “Optical I/O Core”, and Its Application in FPGA

“…The radiation angle from GC has changed at 0.083 degree/nm as a result of high temperature dependence of wavelength in FP-LD. However, as the optical pin has a high refractive index with numerical aperture of more than 0.4 between the core and cladding, the varied radiated light from the GC can be enclosed within the core [11]. Therefore, the calculated misalignment tolerance with 1-dB excess loss between the optical pin with φ 35-μm cladding and GI50 MMF is larger than 10 μm in a temperature range from −45 • C to +85 • C.…”

25-Gbps/ch Error-Free Operation over 300-m MMF of Low-Power-Consumption Silicon-Photonics-Based Chip-Scale Optical I/O Cores

“…Moreover, the optical pins can be formed with a tapered shape and a tilt angle by tuning the UV exposure condition [8]. By applying the taper shape, beam size of the incident light can be controlled, and misalignment tolerance against the outer waveguides can be optimized.…”