125 First principles analysis on proximity gettering sites formed by C_3H_5 cluster ion implantations

Shirasawa, Sho; Sueoka, Koji

doi:10.1299/jsmecmd.2015.28._125-1_

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2019

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“…Shirasawa et al considered these issues from the view point of theoretical solid-state physics [53,54,55]. They conducted a first-principles calculation to determine the binding energies of metallic impurities and carbon complexes with intrinsic point defects.…”

Section: Resultsmentioning

confidence: 99%

Proximity Gettering Design of Hydrocarbon–Molecular–Ion–Implanted Silicon Wafers Using Dark Current Spectroscopy for CMOS Image Sensors

Kurita

Kadono

Shigematsu

et al. 2019

Sensors

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We developed silicon epitaxial wafers with high gettering capability by using hydrocarbon–molecular–ion implantation. These wafers also have the effect of hydrogen passivation on process-induced defects and a barrier to out-diffusion of oxygen of the Czochralski silicon (CZ) substrate bulk during Complementary metal-oxide-semiconductor (CMOS) device fabrication processes. We evaluated the electrical device performance of CMOS image sensor fabricated on this type of wafer by using dark current spectroscopy. We found fewer white spot defects compared with those of intrinsic gettering (IG) silicon wafers. We believe that these hydrocarbon–molecular–ion–implanted silicon epitaxial wafers will improve the device performance of CMOS image sensors.

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Section: Resultsmentioning

confidence: 99%