120-GHz and 240-GHz Broadband Bow-Tie Antennas in eWLB Package for High Resolution Radar Applications

Ahmed, Faisal; Furqan, Muhammad; Stelzer, Andreas

doi:10.23919/eumc.2018.8541732

Cited by 27 publications

(10 citation statements)

References 5 publications

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“…The two are placed together into an epoxy mold before being finished with packing, wiring, dicing, etc. Many companies or organizations have improved and optimized their antenna packages after learning from Infineon’s design architecture [ 25 , 26 ]. In order to use the eWLB, which is a fifth-generation packaging technique, the chip must first be rearranged onto an artificial wafer, followed by fanning out to the chip’s quad-axis, ball planting, and finally, packaging.…”

Section: Advanced Packaging Technologies In Sipmentioning

confidence: 99%

A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging

Wang

Yang

et al. 2023

Micromachines

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The system-in-package (SiP) has gained much interest in the current rapid development of integrated circuits (ICs) due to its advantages of integration, shrinking, and high density. This review examined the SiP as its focus, provides a list of the most-recent SiP innovations based on market needs, and discusses how the SiP is used in various fields. Reliability issues must be resolved if the SiP is to operate normally. Three factors—thermal management, mechanical stress and electrical properties—can be paired with specific examples in order to detect and improve package reliability. This review provides a thorough overview of SiP technology, serves as a guide and foundation for the SiP in package reliability design, and addresses the challenges and potential for further development of this kind of package.

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Section: Advanced Packaging Technologies In Sipmentioning

confidence: 99%

A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging

Wang

Yang

et al. 2023

Micromachines

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“…The BGA connections with the PCB can act as spacers, achieving a few hundred micrometers of separation between the antenna and a PCB-based reflector. A small form factor bow-tie antenna with excellent simulated efficiency was presented in [55]. Rhombic antenna arrays of several sizes have been presented in [54] and [56].…”

Section: Ewlb Technologymentioning

confidence: 99%

A Review of Design and Integration Technologies for D-Band Antennas

Kok

Smolders

Johannsen

2021

IEEE Open J. Antennas Propag.

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This article reviews the current state-of-the-art of millimeter-wave (mm-wave) antennas for communication and sensing applications in the D-band between 110 and 170 GHz. The most popular design techniques, including Antenna-on-Board (AoB), slotted waveguides, Antenna-in-Package (AiP) and Antenna-on-Chip (AoC), are described using relevant examples from scientific literature. Potential benefits and limitations of integration technologies, such as specialized packaging, chip post-processing steps and interconnects, are listed as well. The reported performances of all listed designs are compared against each other, taking the antenna size relative to operating frequency into account. This novel comparison indicates that small-scale integrated AiP and AoC designs can achieve competitive performance levels with short and low-loss interconnects.Index Terms-Antenna-in-Package, Antenna-on-Board, Antenna-on-Chip, D-band, millimeter-Wave This document is a result of the NEXTPERCEPTION project (www.nextperception.eu), which is jointly funded by the European Commission and national funding agencies under the ECSEL joint undertaking.

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“…The eWLB-type approaches are in widespread use nowadays and being optimized continuously [24]. Frequencies beyond 200 GHz and bandwidths of more than 50 GHz have been shown (e.g., [25] states a frequency range from 200 …300 GHz for the interconnect).…”

Section: Embedding Chipsmentioning

confidence: 99%