The Proceedings of the JSME Annual Meeting
 2008
DOI: 10.1299/jsmemecjo.2008.6.0_159
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1035 Microscopic Observation of the Creep-Fatigue Crack Propagation Process in Lead Free Solder

Shinji Sekiguchi
1
,
Takuya Hirasawa
2
,
Keisuke Tanaka
3
et al.
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