2018
DOI: 10.1109/jlt.2017.2743211
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100 GBd Intensity Modulation and Direct Detection With an InP-Based Monolithic DFB Laser Mach–Zehnder Modulator

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Cited by 81 publications
(17 citation statements)
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“…37 High-index-contrast silicon photonics (SiPh) provides dense integration of complex photonic functionalities, such as highspeed modulators, using technology and process toolsets from CMOS electronics. 39 Other photonic integrated circuit (PIC) platforms such as indium phosphide, [40][41][42] which typically relies on 100 mm wafers, and lithium niobate (LiNbO 3 ), 43 which commonly relies on 150 mm wafers, are fabricated in customized fabs. SiPh integrated circuits are typically fabricated on 200 or 300 mm wafers.…”
Section: Introductionmentioning
confidence: 99%
“…37 High-index-contrast silicon photonics (SiPh) provides dense integration of complex photonic functionalities, such as highspeed modulators, using technology and process toolsets from CMOS electronics. 39 Other photonic integrated circuit (PIC) platforms such as indium phosphide, [40][41][42] which typically relies on 100 mm wafers, and lithium niobate (LiNbO 3 ), 43 which commonly relies on 150 mm wafers, are fabricated in customized fabs. SiPh integrated circuits are typically fabricated on 200 or 300 mm wafers.…”
Section: Introductionmentioning
confidence: 99%
“…Eight optical lanes-based 400 GbE solutions are already being deployed [8,9]. Solutions based on eight optical lanes [10][11][12][13][14][15], or even four optical lanes [16][17][18][19][20][21][22][23][24][25][26][27], for 800 GbE are more appealing thanks to the use of using high bandwidth components. This allows reducing of costs, power consumption, and complexity of parallelism.…”
Section: Introductionmentioning
confidence: 99%
“…We foresee that the industrial solution for codesigned and cointegrated electronics and photonics is around the corner. The required ultrahigh bandwidth building blocks are available: integrated circuits for generating PAM4 [43,44] even without equalization [45]; modulators and photodetectors (PD) [17,39,46]; and analogue to digital converter (ADC) frontend for receivers [47]. We also need to mention that electronic instruments, such as arbitrary waveform generators (AWG) and digital storage oscilloscopes (DSO), have reached sampling rates beyond 200 GSa/s with plenty of bandwidth for 100 Gbaud signals.…”
Section: Introductionmentioning
confidence: 99%
“…The datacenter I/O port transmission speed is soon approaching 200-Gbps per lambda [3]. To meet such a high data rate, the intensity modulation direct detection (IM/DD) systems with advanced modulation formats such as pulse amplitude modulation (PAM) or discrete multi-tone (DMT) have been experimentally demonstrated [4][5][6][7][8]13]. However, such an IM/DD system imposes stringent requirements on optoelectronic devices, bringing a significant challenge to cost-sensitive datacenters.…”
Section: Introductionmentioning
confidence: 99%
“…Recently, Volterra filtering [12,13] and machine learning (ML) algorithms [14,15] have been introduced as numerical methods for channel equalization against the nonlinear impairments in 200-Gbps and beyond optical short-reach communication systems [4][5][6][7][8]13]. Compared with the linear signal processing methods employed only in one-dimensional scalar signal space, such as feed forward equalization, these methods handle the signal recovery in a complete and sequential high-dimensional space, known as a Hilbert space (HS).…”
Section: Introductionmentioning
confidence: 99%